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Research of circuit manufacturing for new MID technology development

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Abstract

Recently in the electronics industry, the circuits are growing more and more complex as the number of components increase due to high-performance electronics product development. Accordingly, the trend is smaller, lighter, and higher-concentration electrical circuit, and the new process technology development for such is persistently in progress. Currently, electronics products are restricted in their forms for PCB and product form design due to the increase in the number of components, and there are not only the environmental issues but also unnecessary labor due to the increase in assembly processes. PCB production technology is cheap and convenient, yet has environmental issues. In order to produce PCB, various environmentally harmful chemical substances (Halogen, sulfuric acid, chloric acid, nitric acid, hydrofluoric acid, caustic soda, thinner, etc.) are needed, and a separate chemical substance monitoring system is needed. MID technology can omit such PCB production process and form circuit on the product surface.

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Authors and Affiliations

  1. Gyeongbuk Technopark Lightweight Materials Technology Center, Gyeongbuk, Korea

    Haeyong Yun

  2. School of Mechanical Engineering, Andong National University, Andong, Korea

    Hochan Kim

  3. School of Mechanical Engineering, Chungbuk National University, Chungbuk, Korea

    InHwan Lee

Authors
  1. Haeyong Yun
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  2. Hochan Kim
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  3. InHwan Lee
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Corresponding author

Correspondence to Hochan Kim.

Additional information

Yun Hae Yong (Ph. D.) is Associate Research Engineer of the Gyeongbuk Technopark -Lightweight Materials Technology Center. His research area is Production and processing.

Kim Ho Chan is Professor of Andong National University. His research area is Production and processing.

In Hwan Lee is Professor of Chungbuk National University. His research area is Micro Manufacturing.

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Yun, H., Kim, H. & Lee, I. Research of circuit manufacturing for new MID technology development. J Mech Sci Technol 31, 5737–5743 (2017). https://doi.org/10.1007/s12206-017-1115-z

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  • DOI: https://doi.org/10.1007/s12206-017-1115-z

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