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Standardization of Integrated Circuits Packaging

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Handbook of Integrated Circuit Industry

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Abstract

Packaging standards define the requirements of structure, material, surface coating, external checking, and testing of product reliability, etc. This chapter describes the standardization of IC packaging, including the introduction of international packaging standardization organizations, such as International Electro-technical Commission (IEC), Semiconductor Equipment and Materials International (SEMI), Joint Electronic Device Engineering Council (JEDEC) Standards, and Association Connecting Electronics Industries (IPC) Standards. In addition, China packaging standardization organizations, the description of standardization of package outlines and package naming, National Standard for Integrated Circuit Packaging (GJB), US Military (MIL) standards, and Automotive Electronics Council (AEC)-Q100 Standards are also discussed.

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References

  1. International Electrotechnical Commission (IEC), https://www.oecd.org/gov/regulatory-policy/IEC%20profile.pdf

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Author information

Authors and Affiliations

  1. Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China

    Le Luo

  2. China Electronics Standardization Institute, Bei**g, China

    **g Wang & Kun Li

Authors
  1. Le Luo
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  2. **g Wang
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  3. Kun Li
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Corresponding author

Correspondence to Le Luo .

Editor information

Editors and Affiliations

  1. Institute of Microelectronics, Peking University, Bei**g, China

    Yangyuan Wang

  2. GTA Semiconductor Co., Ltd., Shanghai, China

    Min-Hwa Chi

  3. School of Software and Microelectronics, Peking University, Bei**g, China

    Jesse Jen-Chung Lou

  4. Peng Cheng Laboratory, Shenzhen, Guangdong, China

    Chun-Zhang Chen

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Luo, L., Wang, J., Li, K. (2024). Standardization of Integrated Circuits Packaging. In: Wang, Y., Chi, MH., Lou, J.JC., Chen, CZ. (eds) Handbook of Integrated Circuit Industry. Springer, Singapore. https://doi.org/10.1007/978-981-99-2836-1_61

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