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Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding
Solid–liquid interdiffusion is a metallurgical bonding technique, suitable for assembly of temperature sensitive materials. We identify Ag-(In-Bi) as...
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Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints
Low-temperature solder is needed for temperature-sensitive components, step soldering and wearable devices. Low-temperature bonding is effective for...
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Effects of High-Density Current on the Reliability of Ni-Sn Solid–Liquid Interdiffusion Joints with Al Interlayer
Electric vehicles are becoming increasingly popular as environmentally friendly alternatives to conventional fossil fuel-based vehicles. The need to...
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Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient
A novel solid–liquid interdiffusion (SLID) bonding method with the assistance of temperature gradient (TG) was carried out to bonding Cu and Ni...
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Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures
Wafer-level solid liquid interdiffusion (SLID) bonding, also known as transient liquid-phase bonding, is becoming an increasingly attractive method...
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Robust joining of FGH98 superalloy to DD5 single crystal by modulating interdiffusion behavior with Ni/high-entropy alloy hybrid interlayer
FGH98 superalloys and DD5 single crystals are highly desired to work together in high-temperature service environments. In this study, the FGH98-DD5...
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Interdiffusion Studies in Alloy 617 and 10Cr Steel Joints Using Diffusion Couple Approach and Simulations
In the steam turbine circuit of advanced ultra supercritical power plants dissimilar joints of alloy 617 and 10Cr steel are unavoidable due to...
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Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process
Thermal behavior and phase ratios optimization are the theoretical foundations to tailor the solder joints with high performance and high...
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Mechanism of thermoviscoelasticity driven solid-liquid interface reducing friction for polymer alloy coating
High-temperature ablation is a common failure phenomenon that limits the service life of the transmission parts on heavy-duty machines used in heavy...
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Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging
This paper investigates the solid-liquid-solid interaction between a low-temperature eutectic Sn-58Bi and Sn-3.0Ag-0.5Cu solder alloy during...
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Interdiffusion Coefficients and Strengthening Effects of Nb, Ta, and Zr in the α2-Ti3Al Phase
The creep properties of fully lamellar γ/α 2 titanium aluminides can be significantly improved by alloying with Nb, Ta or Zr. While the influence of...
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Investigating the mechanism of zinc-induced liquid metal embrittlement crack initiation in austenitic microstructure
Catastrophic brittle failure of ductile materials by liquid metal embrittlement (LME) is a widely documented phenomenon but the fundamentals of its...
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Effect of Ni on the wetting and brazing characterization of 304 stainless steel by Ag–Cu alloy
The effect of Ni in Ag–Cu filler on the wetting and brazing characterization of stainless steel was studied by means of wetting test and brazing test...
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Diffusion and reaction mechanism in initial stage of Zn–Al–Mg hot-dip coating: molecular dynamics simulation
Non-equilibrium molecular dynamics was used to simulate the diffusion behavior and reaction mechanism of elements at the solid–liquid interface of...
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Analysis of the Solidus Temperature of Multicomponent Steel by a Finite Thickness Model with Heat- and Solute-Transfer Equations in the Solid–Liquid Zone
To examine the assumption of a constant solidus temperature—which has been empirically adopted in general heat analyses without firm validation—in...
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X-Ray Tomographic Quantification of Diffusive Growth of Metallic Dendrite in High Magnetic Field
Suppressing the melt convection in the solidifying ingot is still considered to be a challenging task. By applying a high-magnetic field (HMF), we...
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Investigation of Cu Interlayer on Joint Formation of Ti/Mg Bimetal Fabricated by Liquid–Solid Compound Casting Process
In this paper, TC4/AZ91D bimetallic composites has been prepared by liquid–solid compound casting process adapting various thickness of Cu coating....
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Remarks on Parabolicity in a One-Dimensional Interdiffusion Model with the Vegard Rule
Until 1948 the interdiffusion theory was based on the Onsager phenomenology, namely thermodynamics of irreversible processes, and a drift was not...
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Evolution of elemental distribution in single liquid precursor–derived nanocomposite solid oxide cell electrodes at nanoscale and its impact on electrochemical performance stability
A powder-free solid oxide cell electrode fabrication route is demonstrated, in which a polymeric precursor, containing the cations of electrocatalyst...
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Si diffusion across the liquid/solid interface of capillary driven (Al–Si)-KxAlyFz micro-layers
AbstractDiffusion is an important phenomenon involved in thermal processing, e.g., a Si diffusion in an (Al–Si)-K x Al y F z clad alloy during aluminum...
