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1. Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

   With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer electronic products, Sn–Ag–Cu series solder has been...

   Fengjiang Wang, Hong Chen, ... Zhijie Zhang in Journal of Materials Science: Materials in Electronics

   Article 10 January 2019
   

2. Liquid structure of Sn-Ag-xCu solders and its effect on the formation and growth of interfacial Cu₆Sn₅

   The liquid structure of Sn-3.5Ag and Sn-3.5Ag-0.7Cu (wt%) solders was first studied using high-temperature X-ray diffraction method. Only short-range...

   Ning Zhao, Xuemin Pan in Journal of Materials Science

   Article 12 June 2020
   

3. The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy

   Nowadays, the development and improvement of physical and mechanical properties of lead-free solders have become a topic of interest for researchers,...

   Hoda Pooshgan, Homam Naffakh-Moosavy in Journal of Materials Science: Materials in Electronics

   Article 07 January 2023
   

4. Effect of pre-soldering temperatures on the microstructures and shear behaviors of SnBi-SAC/ENIG solder joints

   ​Thermal deformation during soldering between the chip and the substrate is an important factor affecting the quality of high-density packaging of...

   Shiqing Lv, Yang Liu, ... Chaoyang **ng in Journal of Materials Science: Materials in Electronics

   Article 08 May 2024
   

5. Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste

   The main aim of this study is to determine the effect of dopant particles on the spreadability of composite solder paste during the reflow soldering...

   M. Tamizi, M. Movahedi, A. H. Kokabi in Journal of Materials Science: Materials in Electronics

   Article 11 February 2023
   

6. Characteristics of eutectic and near-eutectic Zn–Al alloys as high-temperature lead-free solders

   Lead-based alloys are conventionally used for soldering interconnections that are expected to perform at high temperatures. Because of the concerns...

   Mohammad Mehedi Hasan, Ahmed Sharif, M. Abdul Gafur in Journal of Materials Science: Materials in Electronics

   Article 14 December 2019
   

7. New Solder Based on the Sn-Zn Eutectic with Addition of Ag, Al, and Li

   New solder, based on Sn-Zn, with the addition of 1 at.% Ag, 1 at.% Al, and 0.5 at.% Li (SZAAL) was prepared. The influence of alloying elements on...

   Aleksandra Dybeł, Janusz Pstruś in Journal of Materials Engineering and Performance

   Article Open access 23 March 2023
   

8. Increasing the Strength of Soldered Joints by Introducing Carbon Nanotubes into Soldering Pastes

   An increase in the strength of soldered joints obtained by reflow soldering pastes based on lead-free solders by introducing carbon nanotubes into...

   S. A. Zhdanok, V. L. Lanin, ... A. V. Krauklis in Journal of Engineering Physics and Thermophysics

   Article 01 November 2022

9. Microstructure, hardness, electrical, and thermal conductivity of SZCN solder reinforced with TiO₂ and ZrO₂ nanoparticles fabricated by powder metallurgy method

   The microstructure and characterization of Sn–Zn–Cu–Ni (SZCN) solder alloy reinforced with TiO ₂ and ZrO ₂ nanoparticles (NPs) synthesized by powder...

   M. M. Mousa, Moustafa M. Mohammed, ... H. S. Mohamed in Journal of Materials Science: Materials in Electronics

   Article Open access 13 June 2024
   

10. Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering

    The awareness of lead-free solders can be attributed to their environmental and human-health related benefits. Due to this consciousness, research...

    M. A. Abdullah, S. R. A. Idris in Technological Advancement in Mechanical and Automotive Engineering

    Conference paper 2023
    

11. Synergistic size and shape effect of dendritic silver nanostructures for low-temperature sintering of paste as die attach materials

    Electrically conductive epoxy adhesive, which combines with Ag sintering materials rather than traditional Pb-based solder materials, attracts wide...

    Jilei Fan, Gang Li, ... Ching-** Wong in Journal of Materials Science: Materials in Electronics

    Article 04 January 2021
    

12. Development of Geopolymer Ceramic-Reinforced Solder

    This chapter aims to provide a general understanding of the geopolymer usage as a ceramic reinforcement material in the solder alloy. The metal...

    Mohd Mustafa Al Bakri Abdullah, Mohd Arif Anuar Mohd Salleh, ... Mohd Izrul Izwan Ramli in Recent Progress in Lead-Free Solder Technology

    Chapter 2022
    

13. Study on the growth mechanisms of Cu-In compounds at the Sn52In/Cu interface

    Climate change and global temperature increases both impact the environment, as seen through rising sea levels and the food crises. Emissions of...

    Yi-Wun Wang, Guo-Wei Wu in Journal of Materials Science: Materials in Electronics

    Article 12 October 2023
    

14. Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

    Pressureless and low-temperature sintering of Ag paste has been mentioned as a promising strategy to solve the poor performance of large-area chips....

    Hui Fang, Chenxi Wang, ... Tadatomo Suga in Journal of Materials Science: Materials in Electronics

    Article 11 March 2020
    

15. Investigations on the Corrosion Properties of Sn–1Cu–1Ni–xAg Lead Free Solders in 3.5% NaCl Solution

    Abstract

    Due to the directions and environmental legislations from RoHS (Restrictions of Hazardous Substances), WEEE (World Electrical and Electronic...

    S. Jayesh, Jacob Elias in Protection of Metals and Physical Chemistry of Surfaces

    Article 01 July 2021
    

16. A first-principles computation-driven mechanism study on the solders dilute do** effects to η’-Cu₆Sn₅ growth kinetics

    Abstract

    The effects of Ni, Co, In and Zn dilute do** on the Cu ₆ Sn ₅ IMC growth during the interfacial Cu/Sn reactions have been systematically...

    Yong Wang, Yaru Dong, ... Ying Liu in Journal of Materials Science

    Article 01 March 2021
    

17. Packaging Materials in High-Performance Computing Applications

    What drove electronics to what it is today is transistor scaling. But the emerging trend for computing, along with smartphones, IoTs and wearables...

    Markondeya Raj Pulugurtha, Himani Sharma, ... Rao Tummala in Journal of the Indian Institute of Science

    Article 01 January 2022
    

18. An Optimization Design Method of Multi-chip Parallel Power Module Based on Machine Learning

    As an important component in power electronic energy conversion system, power semiconductor module layout and its multi-objective optimization are...

    Jianing Wang, Yaodong Huang, ... Shaolin Yu in The proceedings of the 10th Frontier Academic Forum of Electrical Engineering (FAFEE2022)

    Conference paper 2023
    

19. Wettability and Rheological Behavior of Low Ag Lead-Free SAC/Graphene and Cobalt-Graphene Nanocomposite Solder Paste

    The impacts of dopant nanoparticles, graphene nanosheets (GNSs) and cobalt decorated-graphene nanosheets (CoGNSs), were studied in relation to the...

    M. Tamizi, M. Movahedi, ... S. Azghandi Rad in Metallurgical and Materials Transactions A

    Article 11 May 2022
    

20. Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder

    Until today, there have been abundant research studies conducted by various researchers to improve the existing lead-free solders’ properties with...

    Norainiza Saud, Mohd Arif Anuar Mohd Salleh, ... Mohd Izrul Izwan Ramli in Recent Progress in Lead-Free Solder Technology

    Chapter 2022