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Transient liquid-phase infiltration bonding of copper using porous copper interlayer
A transient liquid-phase infiltration process was applied for the bonding of copper using a porous copper interlayer. Porous copper interlayers with...
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Joined AZ31B Magnesium Alloys with Ag Interlayer by Ultrasonic-Induced Transient Liquid Phase Bonding in Air
AZ31B magnesium alloys are commonly used in lightweight structures of automobile and aerospace industry. In this work, the ultrasonic-induced...
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Transient liquid phase bonding method of SnIn for high-temperature packaging
With the increasing development of semiconductors materials and technology, higher demands are emphasized on the packaging methods and materials for...
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In Situ Electrical Characterization of Transient Liquid-Phase Sintered Alloys
The growing demands of electrification are driving research into new electronic materials. These electronic materials must have high electrical...
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Transient liquid phase infiltration bonding of copper using porous silver insert sheet
A transient liquid-phase infiltration process was successfully applied to the bonding of Cu using a porous Ag insert sheet. Ag particles with a mean...
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Evaluation of the Forming Limit Diagram (FLD) for St-Mg-St Multilayer Sheet Manufactured by Transient Liquid Phase (TLP) Bonding
Multilayer metal sheets have recently attracted significant interest in various applications due to their special properties. One of the common...
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Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process
Thermal behavior and phase ratios optimization are the theoretical foundations to tailor the solder joints with high performance and high...
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Friction stir processing/transient liquid phase bonding (FSP/TLP) of AISI304 stainless steel
Friction stir processing (FSP) is used to eliminate the defects and modify the microstructure of the joints made using other welding and joining...
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Transient liquid phase (TLP)-Bonded Hastelloy X: Understanding the Influence of Bonding Temperature on Hot Corrosion
In this paper, the effects of bonding temperature (T b ) on the microstructure and hot corrosion behavior of transient liquid phase (TLP) bonded...
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The Effect of Bonding Temperature on the Microstructural and Mechanical Properties of Transient Liquid Phase Bonded Commercially Pure Ti Joint
Commercially pure Ti (AMS 4902) was joined using the transient liquid phase bonding technique. The joining process was implemented at various...
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Laminated transient liquid phase preform and bond characterization for high-temperature power electronics application
Transient liquid phase (TLP) bonding is a diffusion bonding process for joining metals using low temperature. Although, TLP is applicable to power...
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Effect of bonding temperature on microstructure and mechanical properties of Inconel 718 alloy transient liquid phase joints
Transient liquid phase (TLP) bonding was used to join Inconel 718 alloy using a Ni-based amorphous foil at the temperature range of 1050–1150 °C and...
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Microstructure and Shear properties of Sn–xZn Transient Liquid Phase Bonding in 3D-Chip Stacking Packaging
The microstructure and shear property of Cu/Sn– x Zn/Cu ( x = 0, 2, 5, 9, 30, 70 wt.%) composite solder joints fabricated by transient liquid phase...
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Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding
Due to the excellent thermoelectric properties and low sintering temperature, nano-Ag paste is a promising die-attach material for high power...
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Transient Liquid Phase Bonding of Ti-6Al-4V/UN32750 Stainless Steel Using Cu and Cu-0.5 wt.% Carbon Nanotube Composite Interlayers
Transient liquid phase (TLP) bonding of Ti-6Al-4 V/UN32750 joint with a composite interlayer of Cu-0.5 wt.% CNT and a pure Cu interlayer has been...
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Dissimilar transient liquid phase bonding of Ti-6Al-4V alloy to Inconel 625 superalloy: effect of bonding temperature on microstructural evolutions and mechanical properties
The present study investigated the effect of bonding temperature on the dissimilar transient liquid phase (TLP)–bonded IN-625/Ti-6Al-4V dissimilar...
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Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform
This study was aimed at examining the applicability of Cu–Sn system transient liquid phase (TLP) bonding using Cu foam to high-temperature operating...
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Effects of Transient Liquid Phase Bonding Time on Microstructure, Mechanical and Corrosion Properties During Bonding of Inconel 617/AISI 310 Stainless Steel
In this study, effects of bonding time on microstructure, mechanical properties and corrosion resistance of transient liquid phase bonded Inconel 617...
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Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding
Cu/In-48Sn- x CuZnAl/Cu ( x = 0, 0.1, 0.2, 0.4, 0.6 wt.%) solder joints were prepared by transient liquid phase (TLP) bonding. The microstructure and...
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Effect of Weld Temperature on Microstructure and Properties of TM52/Q235 Transient Liquid Phase Diffusion-Bonded Joint
TM52/Q235 dissimilar materials were welded by transient liquid phase diffusion bonding (TLP) with BNi2 foil. The effects of welding temperature on...
