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Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding
Solid–liquid interdiffusion is a metallurgical bonding technique, suitable for assembly of temperature sensitive materials. We identify Ag-(In-Bi) as...
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Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints
Low-temperature solder is needed for temperature-sensitive components, step soldering and wearable devices. Low-temperature bonding is effective for...
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Effects of High-Density Current on the Reliability of Ni-Sn Solid–Liquid Interdiffusion Joints with Al Interlayer
Electric vehicles are becoming increasingly popular as environmentally friendly alternatives to conventional fossil fuel-based vehicles. The need to...
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Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient
A novel solid–liquid interdiffusion (SLID) bonding method with the assistance of temperature gradient (TG) was carried out to bonding Cu and Ni...
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Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures
Wafer-level solid liquid interdiffusion (SLID) bonding, also known as transient liquid-phase bonding, is becoming an increasingly attractive method...
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Robust joining of FGH98 superalloy to DD5 single crystal by modulating interdiffusion behavior with Ni/high-entropy alloy hybrid interlayer
FGH98 superalloys and DD5 single crystals are highly desired to work together in high-temperature service environments. In this study, the FGH98-DD5...
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Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process
Thermal behavior and phase ratios optimization are the theoretical foundations to tailor the solder joints with high performance and high...
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Investigating the mechanism of zinc-induced liquid metal embrittlement crack initiation in austenitic microstructure
Catastrophic brittle failure of ductile materials by liquid metal embrittlement (LME) is a widely documented phenomenon but the fundamentals of its...
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Effect of Ni on the wetting and brazing characterization of 304 stainless steel by Ag–Cu alloy
The effect of Ni in Ag–Cu filler on the wetting and brazing characterization of stainless steel was studied by means of wetting test and brazing test...
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Diffusion and reaction mechanism in initial stage of Zn–Al–Mg hot-dip coating: molecular dynamics simulation
Non-equilibrium molecular dynamics was used to simulate the diffusion behavior and reaction mechanism of elements at the solid–liquid interface of...
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Analysis of the Solidus Temperature of Multicomponent Steel by a Finite Thickness Model with Heat- and Solute-Transfer Equations in the Solid–Liquid Zone
To examine the assumption of a constant solidus temperature—which has been empirically adopted in general heat analyses without firm validation—in...
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X-Ray Tomographic Quantification of Diffusive Growth of Metallic Dendrite in High Magnetic Field
Suppressing the melt convection in the solidifying ingot is still considered to be a challenging task. By applying a high-magnetic field (HMF), we...
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Investigation of Cu Interlayer on Joint Formation of Ti/Mg Bimetal Fabricated by Liquid–Solid Compound Casting Process
In this paper, TC4/AZ91D bimetallic composites has been prepared by liquid–solid compound casting process adapting various thickness of Cu coating....
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Si diffusion across the liquid/solid interface of capillary driven (Al–Si)-KxAlyFz micro-layers
AbstractDiffusion is an important phenomenon involved in thermal processing, e.g., a Si diffusion in an (Al–Si)-K x Al y F z clad alloy during aluminum...
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Insights into the Formation of Al–Cu Intermetallic Compounds During the Solid–Liquid Reaction by High-Resolution Transmission Electron Microscopy
During Al/Cu solid–liquid reactionSolid-liquid reaction, different intermetallic compoundsIntermetallic compounds (IMCs) are expected, which can...
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Magnetic-Field-Induced Liquid–Solid Interface Transformation and Its Effect on Microsegregation in Directionally Solidified Ni-Cr Alloy
The transformation of liquid–solid interface induced by the steady magnetic field (SMF) in the directionally solidified Ni-10 wt pct Cr alloy was...
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Mechanism of intergranular penetration of liquid filler metal into oxygen-free copper
Intergranular penetration (IGP) of liquid filler metal (FM) into oxygen-free copper (OFC) occurred when OFC and Ni-plated materials were brazed with...
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Interfacial reactions between pure indium solder and Au/Ni metallization
Thermal interface material (TIM) attracts considerable attention as the increasing demands for efficient heat dissipation in high-performance...
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Enhanced oxidation resistance and adhesion performance of Cr–Mo-coated Zry-4 by a thin Cr layer in steam up to 1600 °C
In this study, Cr–Mo–Cr tri-layer coating with Cr inner layer is designed and compared with the pure Cr coating and Cr–Mo bi-layer coating in steam...
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Ag–(In–Bi) solid-state bonding
Solid-state diffusion bonding is a metallurgical technique to bond interfaces. We identify Ag–(In–Bi) as a material system that can be bonded at...
