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1. Hybrid Solder Joint for Low-Temperature Bonding Application

   Low-temperature bonding has become a significant trend in advanced electronics packaging technology. A low-reflow-temperature process can effectively...

   Yu-Yuan Lai, Jui-Lin Chao, ... Albert T. Wu in Journal of Electronic Materials

   Article 08 December 2022
   

2. Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

   This study was aimed at examining the applicability of Cu–Sn system transient liquid phase (TLP) bonding using Cu foam to high-temperature operating...

   Min-Haeng Heo, Young-** Seo, Jeong-Won Yoon in Journal of Materials Science: Materials in Electronics

   Article 04 July 2024
   

3. Thermodynamic Assessment of Tin Based Molten Binary Indium-Tin Solder Alloys

   It has been focused to develop the lead free solder alloy by substitute the In in place of Pb in Sn-Pb alloy to reduce the harmful effect of lead in...

   M. R. Kumar in Proceedings of the International Conference on Metallurgical Engineering and Centenary Celebration

   Conference paper 2024
   

4. Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint

   Downscaling of electronic devices increased the current density in the solder joint. High current density causes the rapid diffusion of Cu atoms...

   M. Nasir Bashir, Abdul Faheem Khan, ... Imran Ali in Journal of Materials Science: Materials in Electronics

   Article 04 February 2023
   

5. Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration

   Migration of Cu atoms from the cathode side to the anode side causes void formation in the solder joint, which is the root cause of electromigration...

   M. Nasir Bashir, Niaz Bahadur Khan, ... Hafiz Muhammad Saad in Journal of Materials Science: Materials in Electronics

   Article 31 January 2023
   

6. Effect of Cu₆Sn₅ nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints

   The ever-increasing packaging density of electronic products has led to a dramatic reduction in the dimensions of solder joints, which further...

   Ziwen Lv, **tao Wang, ... Hongtao Chen in Journal of Materials Science: Materials in Electronics

   Article 10 March 2023
   

7. Orientation transformation of Cu₆Sn₅ grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

   Cu ₆ Sn ₅ intermetallic compound (IMC), which occupies most even full of solder joints bringing by the reduced size of interconnection and the...

   Yuanyuan Qiao, Hongwei Liang, Ning Zhao in Journal of Materials Science

   Article 27 February 2023
   

8. Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration

   In Sn-based solder joints, the size of interfacial IMC grains plays an important role in determining the properties of solder joints. An effort has...

   M. Nasir Bashir, A. S. M. A. Haseeb in Journal of Materials Science: Materials in Electronics

   Article 31 May 2022
   

9. Effect of (111) oriented nanotwinned Cu substrate on the electromigration of Sn58Bi solder joint at high current density

   (111) oriented nanotwinned copper ((111)nt-Cu) has attracted much attention and shown a good application prospect as Under Bump Metallurgy (UBM) in...

   Jiaqi Zhang, **ngming Huang, ... Zhi-Quan Liu in Journal of Materials Science: Materials in Electronics

   Article 02 July 2024
   

10. Calorimetric measurements of Ga–In, Ga–Sn, and In–Sn binary alloy systems as sustainable lead-free solder alternatives

    The main objective in exploring a lead-free solder system comprising Gallium, Indium, and Tin lies in the desire to mitigate health hazards related...

    Vikrant Singh, Dileep Pathote, ... C. K. Behera in Journal of Materials Science: Materials in Electronics

    Article 04 November 2023
    

11. Measurement of Mixing Enthalpies for Sn-Bi-Sb Lead-Free Solder System

    Predictions of the thermodynamic behavior of higher-order multicomponent alloys from thermodynamic data of binary and ternary systems have been...

    Vikrant Singh, Dileep Pathote, ... C. K. Behera in Journal of Electronic Materials

    Article 11 July 2023
    

12. Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties

    A novel friction micro-welding (FMW) technology was used for copper column connection of column grid array (CGA) packaging. The investigation found...

    Zhili Zhao, Kai **ao, ... Jiazhe Li in Journal of Materials Science: Materials in Electronics

    Article 20 January 2023
    

13. Effect of P content on diffusion resistance and interfacial mechanical properties of crystalline Co–P coatings in solder joints

    Electroplating crystalline cobalt–phosphorus (Co–P, with 1 ~ 8 at.% P) is a potential interfacial layer for electronic packaging solder joints,...

    Cheng Zhen, Limin Ma, ... Fu Guo in Journal of Materials Science: Materials in Electronics

    Article 31 January 2023
    

14. Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder

    Single Ni layer is often inserted as diffusion barrier between Cu pillar and Sn-based solder to avoid excessive growth of brittle intermetallic...

    Haokun Li, Chongyang Li, ... Ming Li in Electronic Materials Letters

    Article 03 April 2024
    

15. Effect of temperature on the electrical conduction and dielectric behavior of solder

    Solder is widely used as an electrical conductor in electronics. This paper reports the effect of heating up to 70 °C on the conduction and...

    Wenyi Yang, D. D. L. Chung in Journal of Materials Science: Materials in Electronics

    Article 08 February 2021
    

16. Preventing Void Growth Between Ni₃Sn₄ and Solder

    An increasing number of applications of microelectronics products involve multiple reflows and/or extended operation at temperatures high enough that...

    M. Njuki, S. Thekkut, ... N. Dimitrov in Journal of Electronic Materials

    Article 17 August 2022
    

17. Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding

    A low-temperature solid-state bonding technology using palladium-coated Co micro-nano cones array (MCA) and Sn-3.0Ag-0.5Cu (wt%) solder was...

    Jiunan **e, Hua Hu, ... Ming Li in Electronic Materials Letters

    Article 25 September 2023
    

18. Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates

    This paper presents the results of the Ni substrate wetted with the liquid Sn-Zn eutectic alloy with the addition of Ag, Al, and Li (84.3 at.% Sn,...

    Aleksandra Dybeł, Paweł Czaja, ... Janusz Pstruś in Journal of Materials Engineering and Performance

    Article Open access 17 April 2023
    

19. Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition

    Nanocrystalline Ni-Mo coatings, obtained by electroplating, were investigated as an alternative barrier layer between the Cu substrate and Sn solder....

    Agnieszka Bigos, Fabrizio Valenza, ... Joanna Wojewoda-Budka in Journal of Materials Engineering and Performance

    Article 11 April 2022
    

20. Electrochemical deposition of Sn-0.7Cu alloy modified with nano-WO₃ for high-density mini-LED packaging

    In this work, Sn-0.7Cu-WO ₃ nanomodified solders were electrodeposited from an aqueous acidic plating bath containing various fractions of WO ₃ ...

    Gyeong Ah Lee, Ashutosh Sharma, Jae Pil Jung in Journal of Materials Science: Materials in Electronics

    Article 13 May 2024