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First-Principles Study on the Structural, Elastic and Thermodynamic Properties of Binary Pd-Sn Compounds
The structural, mechanical, thermodynamic and electronic properties of Pd-Sn compounds including PdSn 4 , PdSn 3 , PdSn 2 , PdSn, Pd 2 Sn and Pd 3 Sn have been...
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Thermodynamic Assessments of the Pd–Sn and Pt–Sn Systems With the Modified Quasi-chemical Model for Liquid
The phase equilibria and thermodynamic properties of the Pd–Sn and Pt–Sn alloys have been studied intensively due to the importance of these systems...
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Growth of phases in the solid-state from room temperature to an elevated temperature in the Pd–Sn and the Pt–Sn systems
The solid-state growth of the product phases in bulk and electroplated diffusion couples of the Pd–Sn and the Pt–Sn systems is reported at various...
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Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder
Using an electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish with a thick palladium–phosphorus (Pd-P) layer of 1 μ m, the...
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Pd and Au Contacts to SnS: Thermodynamic Predictions and Annealing Study
Tin(II) sulfide (SnS) is emerging as an attractive p -type absorber layer material for thin film photovoltaics, which motivates the search for Ohmic,...
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Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction
Ag–Pd alloys are widely used as thick-film conductors and are potential alternatives to the expensive Au bump. In this work, because Sn is the...
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Experimental Determination and Thermodynamic Modeling of the Sn-Rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250°C
The Sn-rich portion of the phase diagram for the Ni-Pd-Sn ternary system was preliminarily obtained by interpolation of the three constituent binary...
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Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys
Recently, Pd surface finishes over Cu substrates have been widely used in microelectronic packaging to prevent pad oxidation before soldering and to...
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Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures
The kinetics of solid-state reactive diffusion in the (Pd-Cu)/Sn system was experimentally observed to examine how adding Cu into Pd influenced the...
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Diffusion and growth mechanism of phases in the Pd-Sn system
Growth mechanism of phases and atomic mechanism of diffusion are discussed in the Pd-Sn system. The Kirkendall marker plane location indicates that...
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Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System
The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be...
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Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy
The interface microstructures as well as the rate kinetics of dissolution and intermetallic compound (IMC) layer formation were investigated for...
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Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy
The interface microstructures and dissolution behavior were studied, which occur between 99.9 pct Pd substrates and molten 95.5Sn-3.9Ag-0.6Cu...
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Strong effect of Pd concentration on the soldering reaction between Ni and Sn–Pd alloys
The effect of Pd concentration on the soldering reaction between Ni and Sn– x Pd alloys ( x = 0–0.5 wt%) was investigated in this study. When the Pd...
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Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples
Sn-Co-Ni alloys of 25 different compositions have been prepared and equilibrated at 250 °C. A new ternary (Ni, Co)Sn 4 phase is found, and all the...
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Solder Reactions on Nickel, Palladium, and Gold
In this chapter we shall discuss solder reaction with Ni, Pd, and Au. These metals and Cu are being used in under-bump metallization (UBM) or in bond...
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Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates
The interfacial reaction between two prototype multicomponent lead-free solders, Sn-3.4Ag-1Bi-0.7Cu-4In and Sn-3.4Ag-3Bi-0.7Cu-4In (mass%), and Ag,...
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Intermetallic growth between lead-free solders and palladium
Intermetallic growth between Pd and the lead-free solders Sn-Ag and Sn-Ag-Cu has been studied. Diffusion couples were prepared by reflowing the...
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Microstructures in solder joints between Sn95.5Ag4Cu0.5 solder and Ag/Pd thick film
A joint between Sn95.5Ag4Cu0.5 (mass%) solder and an Ag/Pd thick film was soldered by dip** at 260°C for 3–30 sec. Shrinkage voids and Sn grain...
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Thermodynamic modeling of the palladium-lead-tin system
A set of self-consistent, thermodynamic model parameters is presented to describe the phase equilibria of Palladium-Lead (Pd-Pb) and Palladium-Tin...