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Etching of scandium-doped aluminum nitride using inductively coupled plasma dry etch and tetramethyl ammonium hydroxide
Properties such as wide bandgap, higher electromechanical coupling, and low dielectric permittivity have propelled Sc x Al 1− x N as an advantageous...
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Influence of Dry and Wet Etching on AlInSb Contact Resistivity, Transfer Length, and Sheet Resistance Using Circular Transmission Model
The ohmic contact property is a major concern in semiconductors, and in particular InSb 2DEG devices, that is essentially related to the surface...
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Sequenced Etching Technique
A technique for detecting defect depth profiles using isotope positrons will be presented; however, sequential chemical etching will be used for...
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Effects of Dry Etching Plasma Treatments on Natural and Synthetics Fibers: a Comparative Study
Nowadays, natural and synthetic fibers are becoming a valuable resource for composite industry. The use of natural and synthetic fibers as...
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Wet chemical etching of silicon for conically textured surfaces
We disclose a method for the wet chemical etching of silicon (001) surface with a conical texture. This method involves a single-step etching process...
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Atomic Layer Etching Applications in Nano-Semiconductor Device Fabrication
These days, the process of plasma etching is exhibited in various forms, including the reactive ion etching (RIE) method. Not only memory device but...
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Dry Etching Damage and Alloy Composition Analysis of GaN-Based Semiconductors Using Electron Energy-Loss Spectroscopy
Dry etching damage and compositional fluctuation of GaN-based semiconductors and alloys are major issues to overcome to improve device fabrication...
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A wear-resistant superhydrophobic surface on Q235 steel prepared by electrospark deposition and electrochemical etching
The special wettability of superhydrophobic metal surface endows it with considerable application potential in various fields, but the vulnerability...
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Controlled and Fast Fabrication for P-Type Porous Silicon Structures with a High Aspect Ratio by Electrochemical Etching
In this experiment, electrochemical etching of ordinary P -type monocrystal silicon was firstly studied in a mixed etching solution of hydrofluoric...
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Study on Wet Chemical Etching of Flexible Printed Circuit Board with 16-μm Line Pitch
As high-precision flexible printed circuit boards (FPCBs) are required in electronic products, it is necessary to study wet chemical etching to...
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Preparation and Interfacial Analysis of Ag/Cu Coating on Acrylonitrile Butadiene Styrene Surface by Chemical Etching and Self-assembly Modification
Surface metallization remains a promising approach for combining the unique properties of plastics and metals. To enhance the interfacial bonding of...
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The oxygen plasma etching behavior onto diamond-like carbon coating for micro-texturing: Experimental and molecular dynamics study
In this study, the experiment and molecular dynamic simulations were used to show how oxygen plasma etching works on diamond-like carbon (DLC) for...
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Roughness Analysis of Powder-Bed Fused Nickel–Titanium Surfaces with Chemical Etching Enhancement by a Safe Aqueous Fluoride Solution
Surface treatments for metal additive manufacturing have been increasingly explored to remedy undesired high surface roughness in as-printed...
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A clean dry transfer of hexagonal boron nitride with improved oxidation resistance
Hexagonal boron nitride (h-BN) is an outstanding two-dimensional material in terms of thermal stability and chemical inertness, enabling its...
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Influence of deep reactive ion etching process parameters on etch selectivity and anisotropy in stacked silicon substrates for fabrication of comb-type MEMS capacitive accelerometer
This paper presents etching optimization of comb structure formation in small silicon substrates mounted on a large silicon wafer (150 mm diameter)...
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Properties enhancement of TiO2 nanorod thin film using hydrochloric acid etching treatment method
The properties of the as-deposited and etched TiO 2 nanorod were characterized using X-ray Diffraction (XRD), Field Emission Scanning Electron...
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DLC-Coated Thermoplastics: Tribological Analyses Under Dry and Lubricated Sliding Conditions
The purpose of this study was to increase the limited wear resistance of polymers in highly stressed tribological contacts. Therefore, diamond-like...
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Advancements in oxidative chemical vapor deposition (oCVD) with liquid oxidant: A true dry vacuum manufacturing approach for optoelectronic devices
Conducting polymers have attracted significant interest due to their unique properties, including metal-like conductivity, ionic conductivity,...
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Experimental research on damage and formation limits on porous silicon materials by electrochemical etching method
Efficient silicon electrochemical etching (anodization) is essential to produce porous silicon (PSi) for a wide variety of applications, but the...
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Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics
Advanced transfer printing technologies have enabled the fabrication of high-performance flexible and stretchable devices, revolutionizing many...
