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Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization
An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed...
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Effect of Cyclic Damage on the Constitutive Behavior & Microstructure of Sn3.0Ag0.5Cu (SAC305) Solder
This study examines the effect of cyclic damage on the constitutive response and microstructural evolution of SAC305 solder. Cyclic damage is induced...
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Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface
A three-dimensional VOF model has been developed to predict the oblique impact of a molten solder droplet onto a groove with the impact point to be...
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Current-induced growth of P-rich phase at electroless nickel/Sn interface
The role of high current stressing during growth of the P-rich phase at the electroless Ni/Sn interface was examined by transmission electron...
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Comparative study on stress–strain hysteresis response of SAC solder joints under thermal cycles
The present study attempts to evaluate the stress-strain hysteresis responses of SAC solder joints in Resistor and FleXBGA144 packages subjected to...
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A Study of Nanoparticles in SnAg-Based Lead-Free Solders
Tin–lead (Sn-Pb) solder alloy has been widely used as an interconnection material in electronic packaging due to its low melting temperatures and...
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Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests
The reliability of lead-free electronic assemblies after board level drop tests was investigated. Thin small outline package (TSOP) components with...
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Creep Life Assessment of Tin-Based Lead-Free Solders Based on Imaginary Initial Strain Rate
The creep properties of tin-based, lead-free solders, Sn-3.0Ag-0.5Cu and Sn-7.5Zn-3.0Bi, were investigated for the temperature range from 298 K to...
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Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on...
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Life expectancies of Pb-free SAC solder interconnects in electronic hardware
The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use of lead (Pb) by the...
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Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles
Electroless Ni-P/Cu under-bump metallization (UBM) is widely used in electronics packaging. The Sn3.0Ag0.5Cu lead-free composite solder pastes were...
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Deformation behavior of tin and some tin alloys
Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are...
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Influence of Ni concentration and Ni3Sn4 nanoparticles on morphology of Sn-Ag-Ni solders by mechanical alloying
The mechanical alloying (MA) process was employed as an alternative method to produce the lead-free solder pastes of Sn-3.5Ag-xNi (x=0.1, 0.5, 1.0,...
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Effects of load and thermal conditions on Pb-free solder joint reliability
Reliability of lead-free solder joints has been a hot topic widely debated in the electronic industry. Most published data indicate that a change to...