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Accelerated Metastable Solid–liquid Interdiffusion Bonding with High Thermal Stability and Power Handling
Emerging high-performance systems are driving the need for advanced packaging solutions such as 3-D integrated circuits (ICs) and 2.5-D system...
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Effect of Ag nanoparticles on microstructure, dam** property and hardness of low melting point eutectic tin–bismuth solder
This paper investigates the effects of nanosized Ag particles on microstructure, physical and mechanical properties of environmental-friendly low...
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First-principles screening of structural properties of intermetallic compounds on martensitic transformation
Martensitic transformation with good structural compatibility between parent and martensitic phases are required for shape memory alloys (SMAs) in...
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Electrodeposition of Sn-Ni Alloy Coatings for Water-Splitting Application from Alkaline Medium
In this work, Sn-Ni alloy coatings were developed onto the surface of copper from a newly formulated electrolytic bath by a simple and cost-effective...
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Grain Boundary Penetration of Various Types of Ni Layer by Molten Metals
The grain boundary penetration of three types of Ni layer, Ni foil, electroplated Ni, and electroless Ni, by molten Pb and 95Pb5Sn (wt.%) is...
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A superior interfacial reliability of Fe–Ni UBM during high temperature storage
Ball shear test was conducted on the SnAgCu/Fe–Ni solder joints, as well as SnAgCu/Cu for comparison after reflow and 150 °C high temperature storage...
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Structural and Tribological Properties of Nanostructured Supersonic Cold Sprayed Ni-20 wt.% Sn Coatings
80-μm-thick nanostructured coatings consisting of a Ni solid solution, Ni 3 Sn, Ni 3 Sn 2 , and metastable NiSn intermetallic phases were deposited via...
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Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
Microstructural evolution of the Cu/solder/Cu pillar-type bonding structures with a reduced solder volume subjected to thermal aging at 423 K to...
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First-principles study of structural, elastic and thermodynamic properties of Ni–Sn–P intermetallics
First-principles calculations are performed to investigate the structural, elastic, and thermodynamic properties of Ni 3 SnP, Ni 2 SnP, Ni 10 SnP 3 , and Ni 2 P...
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Composition-dependent phase substitution in directionally solidified Sn-22at.%Ni peritectic alloy
Growth substitution of the primary Ni 3 Sn 2 phase by peritectic Ni 3 Sn 4 phase during solidification has been observed for the first time in...
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Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations
Transient liquid phase (TLP) bonding of Cu substrates was conducted with interlayer systems with the stacking sequences Ag–Sn–Ag (samples A),...
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Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection
In this paper, the microstructural evolution and properties of Au-20wt.%Sn|Ni reaction couples were investigated from two perspectives: (1) by...
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Phase Equilibria of the Sn–Ni–V System: The 980°C Isothermal Section and the Sn-Rich Corner at 600°C and 300°C
Ternary Sn–Ni–V alloys were prepared and annealed at 980°C, 600°C, and 300°C for 15, 60 and 60 days, respectively. The annealed alloys were...
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Phase Equilibria of the Sn–Ni–Si Ternary System and Interfacial Reactions in Sn–(Cu)/Ni–Si Couples
Interfacial reactions in Sn/Ni–4.5 wt.%Si and Sn–Cu/Ni–4.5 wt.%Si couples at 250°C, and Sn–Ni–Si ternary phase equilibria at 250°C were investigated...
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Interfacial reactions and diffusion path in gold–tin–nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging
In this work, Au–Sn eutectic bonding and Au–Sn thermo-compression bonding are studied for applications in hermetic packaging at wafer level....
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Ternary intermetallic compounds in Au–Sn soldering systems—structure and properties
The intermetallic compound AuSn is essential for the wetting of Au-rich AuSn solders. On the addition of In or Sb, pseudo-binary compounds AuSn 1− x ...
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The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints
We have investigated the effect of small amounts of Cu on suppression of metastable β Sn-NiSn 4 eutectic growth in solder joints between Sn-3.5Ag- x Cu...
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Phase Equilibria of the Sn-Ni-V System at 800°C
Ternary Sn-Ni-V alloys were prepared and annealed at 800°C for 60 days. The annealed alloys were metallographically examined, and the equilibrium...
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The Isothermal Section of the Sn-Sb-Ni Ternary System at 270°C
Phase equilibria of the Sn-Sb-Ni ternary system at 270°C are experimentally determined in this work. Experimental results reveal both the Sn 3 Sb 2 and...
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A review of phase equilibria in Heusler alloy systems containing Fe, Co or Ni
The phase equilibria associated with Heusler-type intermetallic compounds have been reviewed for systems containing Fe, Co or Ni. Ternary alloy...
