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1. Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

   Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have been extensively investigated. With the extensive prevalence of 3D IC...

   Jie Wu, Song-bai Xue, ... Liu-jue Wang in Journal of Materials Science: Materials in Electronics

   Article 23 July 2016
   

2. Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

   The anisotropy of Sn crystal structures greatly affects the electromigration (EM) and thermomechanical fatigue (TMF) of solder joints. The size of...

   Yong Zuo, Thomas R. Bieler, ... Fu Guo in Journal of Electronic Materials

   Article 06 December 2017

3. Mass transport phenomena in copper nanowires at high current density

   Electromigration in Cu has been extensively investigated as the root cause of typical breakdown failure in Cu interconnects. In this study, Cu...

   Yu-Ting Huang, Chun-Wei Huang, ... Wen-Wei Wu in Nano Research

   Article 24 February 2016
   

4. Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

   In situ observation of electromigration (EM) has been carried out on cross-sectioned copper/tin–copper/copper (Cu/Sn0.7Cu/Cu) line-type...

   Ze Zhu, Yi Li, ... Fengshun Wu in Journal of Materials Science: Materials in Electronics

   Article 22 February 2017
   

5. Influence of Gaseous Media Flow in the Dual Ar-H₂-H₂O/air Atmosphere Setup on the Scale Growth Kinetics of Crofer 22APU Ferritic Stainless Steel

   The problem of gaseous media distribution within the metallic interconnects in solid oxide fuel cells (SOFCs) and its influence on the oxidation...

   Mirosław Stygar, Juliusz Dąbrowa, ... Tomasz Brylewski in Journal of Materials Engineering and Performance

   Article 20 December 2016
   

6. On the thickness of Cu₆Sn₅ compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration

   Anil Kunwar, Haoran Ma, ... Mingliang Huang in Journal of Materials Science: Materials in Electronics

   Article 16 April 2016
   

7. Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress

   Due to the complicated configuration of real micro ball grid array (μBGA) package, kinds of physical failure mechanisms occurs and mixed together in...

   Baolei Liu, Yanhong Tian, ... Chenxi Wang in Journal of Materials Science: Materials in Electronics

   Article 12 July 2016
   

8. Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

   This study investigated the microstructure, especially intermetallic compounds (IMCs), formed between a Cu pillar and Cu trace joined by thermal...

   Chien-Lung Liang, Kwang-Lung Lin, Jr-Wei Peng in Journal of Electronic Materials

   Article 30 September 2015

9. Vanadium Monocarbide

   Vanadium forms with carbon plenty of chemical compounds (see also section C – V in Table I-2.13): vanadium monocarbide VC1–x having the broad...

   Igor L. Shabalin in Ultra-High Temperature Materials III

   Chapter 2020
   

10. In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient

    Synchrotron radiation real-time imaging technology was performed to in situ study the Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under...

    Yi Zhong, Mingliang Huang, ... Ning Zhao in Journal of Materials Research

    Article 01 March 2016
    

11. Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects Under Current Stressing

    The effect of electromigration in Cu-cored Sn-3.5Ag-0.7Cu solder interconnects under current stressing was investigated. After current stressing at a...

    **anzhang Sa, Wei Zhou, ** Wu in Journal of Electronic Materials

    Article 11 February 2014

12. Materials challenges in three-dimensional integrated circuits

    In the present era of big data and the Internet of things (the interconnection of computing devices in the Internet infrastructure), the fabrication...

    Kuan-Neng Chen, King-Ning Tu in MRS Bulletin

    Article 10 March 2015
    

13. Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape

    In this research, two different Sn3.0Ag0.5Cu solder bump joints with barrel shape and hourglass shape respectively were fabricated by controlling...

    ** Chen, **uchen Zhao, ... Yue Gu in Journal of Materials Science: Materials in Electronics

    Article 20 December 2014
    

14. Titanium Monocarbide

    Similarly to other transition metals of group 4 – hafnium and zirconium, titanium forms with carbon, practically, the only one chemical compound (see...

    Igor L. Shabalin in Ultra-High Temperature Materials III

    Chapter 2020
    

15. Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints

    Reduction in microelectronic interconnect size gives rise to solder bumps consisting of few grains, approaching a single- or bicrystal grain...

    Amaneh Tasooji, Leticia Lara, Kyuoh Lee in Journal of Electronic Materials

    Article 05 August 2014

16. Growth of skyrmionic MnSi nanowires on Si: Critical importance of the SiO₂ layer

    MnSi in the B20 structure is a prototypical helimagnet that forms a skyrmion lattice, a vortex-like spin texture under applied magnetic field. We...

    Siwei Tang, Ivan Kravchenko, ... Zheng Gai in Nano Research

    Article 04 September 2014
    

17. Effect of TiO₂ addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu–xTiO₂ nano-composite solders

    In the present study, addition of TiO ₂ nanoparticles with a concentration in the range from 0 to 0.75 wt% into eutectic Sn3.0Ag0.5Cu solders were...

    Yi Li, **uChen Zhao, ... Yong Wang in Journal of Materials Science: Materials in Electronics

    Article 21 June 2014
    

18. Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging

    This study investigated electromigration (EM) behaviors of Pb-free microbumps in three-dimensional integrated circuit (3D IC) packaging under...

    Hao Hsu, Tzu-Yang Lin, Fan-Yi Ouyang in Journal of Electronic Materials

    Article 31 October 2013

19. Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density

    This work investigated the microstructure evolution of Cu-cored Sn solder joints under high temperature and high current density. The Cu ₆ Sn ₅ phase...

    **anzhang Sa, ** Wu in Journal of Electronic Materials

    Article 04 May 2013

20. Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature

    Sintered nanoscale silver is a promising interconnection material for semiconductor devices because it provides improved joint properties compared...

    Jesus N. Calata, Guo-Quan Lu, ... Luu Nguyen in Journal of Electronic Materials

    Article 12 October 2013