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Showing 61-80 of 238 results
  1. pMOSFETs Featuring ALD W Filling Metal Using SiH4 and B2H6 Precursors in 22 nm Node CMOS Technology

    In this paper, pMOSFETs featuring atomic layer deposition (ALD) tungsten (W) using SiH 4 and B 2 H 6 precursors in 22 nm node CMOS technology were...

    Guilei Wang, Jun Luo, ... Henry H. Radamson in Nanoscale Research Letters
    Article Open access 26 April 2017
  2. Semiconductors

    Our technologically advanced way of life would not be possible without the semiconductor industry. The first semiconductor device, known as a...
    Bradley D. Fahlman in Materials Chemistry
    Chapter 2018
  3. Phase-Change Memory Device Architecture

    In this chapter we review the main categories of device architectures that have been studied and realized in order to exploit the phase-change...
    Fabio Pellizzer in Phase Change Memory
    Chapter 2018
  4. Integration of Highly Strained SiGe in Source and Drain with HK and MG for 22 nm Bulk PMOS Transistors

    In this study, the integration of SiGe selective epitaxy on source/drain regions and high-k and metal gate for 22 nm node bulk pMOS transistors has...

    Guilei Wang, Jun Luo, ... Tianchun Ye in Nanoscale Research Letters
    Article Open access 16 February 2017
  5. Influence of Design and Process Parameters of 32-nm Advanced-Process High-k p-MOSFETs on Negative-Bias Temperature Instability and Study of Defects

    Negative-bias temperature instability (NBTI) has become a prominent factor limiting scaling of complementary metal–oxide–semiconductor technology....

    A. F. Muhammad Alimin, A. A. Mohd Radzi, ... H. Hussin in Journal of Electronic Materials
    Article 22 May 2017
  6. A 100-V High-Performance SOI Trench LDMOS with Low Cell Pitch

    In this paper, we report structural modifications in the conventional laterally diffused metal–oxide–semiconductor (LDMOS) field-effect transistor on...

    Mayank Punetha, Yashvir Singh in Journal of Electronic Materials
    Article 19 May 2015
  7. Performance and Reliability of SiC Power MOSFETs

    Due to the wide bandgap and other key materials properties of 4H-SiC, SiC MOSFETs offer performance advantages over competing Si-based power devices....

    Daniel J. Lichtenwalner, Brett Hull, ... John W. Palmour in MRS Advances
    Article 07 January 2016
  8. Dielectric Materials for Microelectronics

    Dielectrics are an important class of thin-film electronic materials for microelectronics. Applications include a wide swathe of device applications,...
    Chapter 2017
  9. Impact of Metals on Silicon Devices and Circuits

    This Chapter overviews the possible impact of metal impurities on the operation, reliability and yield of devices and circuits. In a first part, the...
    Chapter 2018
  10. A Novel Nanofabrication Technique of Silicon-Based Nanostructures

    A novel nanofabrication technique which can produce highly controlled silicon-based nanostructures in wafer scale has been proposed using a simple...

    Lingkuan Meng, **aobin He, ... Jiang Yan in Nanoscale Research Letters
    Article Open access 15 November 2016
  11. Hybrid Memories Based on Redox Molecules

    The attempt to use molecules as functional parts of nanoelectronic devices is based on the benefits expected from their inherent properties. They are...
    Chapter 2017
  12. Comparison of channel mobility and oxide properties of MOSFET devices on Si-face (0001) and A-face (11-20) 4H-SiC

    In this report we present results comparing lateral MOSFET properties of devices fabricated on Si-face (0001) and A-face (11-20) 4H-SiC, with nitric...

    Daniel J. Lichtenwalner, Lin Cheng, ... Charles Scozzie in MRS Online Proceedings Library
    Article 01 December 2014
  13. Metamorphic transistors: Building blocks for hetero-integrated circuits

    Metamorphic epitaxy offers the possibility of growing devices on wafers composed of different materials that might be larger than the native bulk...

    Kenneth E. Lee, Eugene A. Fitzgerald in MRS Bulletin
    Article 14 March 2016
  14. A roadmap for future wide bandgap semiconductor power electronics

    Energy savings and efficient usage of electric power are some of the most urgent issues for future sustainable development of human society. Power...

    Hajime Okumura in MRS Bulletin
    Article 08 May 2015
  15. Atomic Layer Deposition

    Charles L. Dezelah in Encyclopedia of Nanotechnology
    Reference work entry 2016
  16. Applications of three-dimensional LSI

    To overcome various concerns due to scaling-down device size in future large-scale integration (LSI), it is indispensable to introduce a new concept...

    Mitsumasa Koyanagi, Takafumi Fukushima, ... Tetsu Tanaka in MRS Bulletin
    Article 10 March 2015
  17. Physical principles and current status of emerging non-volatile solid state memories

    Today the influence of non-volatile solid-state memories on persons’ lives has become more prominent because of their non-volatility, low data...

    L. Wang, C.-H. Yang, J. Wen in Electronic Materials Letters
    Article 10 July 2015
  18. A review of high-temperature electronics technology and applications

    Electronics that must operate at extreme temperatures present a unique set of challenges that must be carefully addressed. We review the applications...

    Article 17 July 2015
  19. III–V compound semiconductor transistors—from planar to nanowire structures

    Conventional silicon transistor scaling is fast approaching its limits. An extension of the logic device roadmap to further improve future...

    Heike Riel, Lars-Erik Wernersson, ... Jesús A. del Alamo in MRS Bulletin
    Article 14 August 2014
  20. AlGaN devices and growth of device structures

    The structure of a number of GaN/AlGaN devices and their associated material growth and processing issues are examined in some detail, and...

    K. A. Jones, T. P. Chow, ... G. S. Tompa in Journal of Materials Science
    Article 24 February 2015
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