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1. Investigation of discontinuous precipitation upon age-hardening of invar-based Sn alloy

   Age-hardening of homogenized and cold-rolled invar-based Sn alloys results in the development of continuously-formed (CP) and discontinuously-formed...

   Maryam Akhlaghi, Reza Rahimi, ... Olena Volkova in Journal of Materials Research

   Article 01 October 2017
   

2. Two-Phase η′ + η Region in Cu₆Sn₅ Intermetallic: Insight into the Order–Disorder Transition from Diffusion Couples

   The ongoing electrification and miniaturization increase the quality demands on solder joints. A bottleneck for solder joint reliability can be the...

   Christian Wieser, Werner Hügel, ... Andreas Leineweber in Journal of Electronic Materials

   Article 11 October 2019

3. Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

   Low-temperature soldering constitutes a promising solution in interconnect technology with the increasing trend of heat-sensitive materials in...

   Kelvin P. L. Pun, M. N. Islam, ... Alan H. S. Chan in Journal of Electronic Materials

   Article 31 May 2018

4. High-performance anode materials for Na-ion batteries

   Na-ion batteries are considered a promising alternative to Li-ion batteries for large-scale energy storage systems due to their low cost and the...

   De-Liang Cheng, Li-Chun Yang, Min Zhu in Rare Metals

   Article 13 March 2018
   

5. Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

   Wetting of Al and Ni substrate by Sn-Zn eutectic-based alloys with 0.5 (wt.%) of Ga and 0.2 (wt.%) of Na was studied using the sessile drop method in...

   Tomasz Gancarz, Piotr Bobrowski, ... Katarzyna Janik in Journal of Electronic Materials

   Article Open access 15 September 2017

6. Microstructure evolution and shear behavior of Au–Sn/Ni–xCo (x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C

   Interfacial reaction and shear behavior of the joints between the Au–29Sn (at.%) solder and the Ni– x Co ( x = 20, 40, 60, and 80 at%) alloys soldered...

   J. Peng, R. C. Wang, ... H. S. Liu in Journal of Materials Science: Materials in Electronics

   Article 30 January 2017
   

7. Annealing or direct synthesis of uniform inorganic nanoparticles using salt powder as separation medium

   Uniform nanoparticles have shown to hold great potential in many different fields. As a result, many resources have been devoted to the search for a...

   Wytse Hooch Antink, Yejung Choi, Yuanzhe Piao in Journal of Nanoparticle Research

   Article 31 October 2017
   

8. Synthesis and Characterization of Pure Ni and Ni-Sn Intermetallic Nanoparticles

   The present research focused on the synthesis of Ni and Ni-Sn nanoparticles via a chemical reduction method using hydrazine hydrate. The syntheses...

   A. Yakymovych, H. Ipser in Nanoscale Research Letters

   Article Open access 21 February 2017
   

9. Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test

   This study focuses on the microstructural evolution process of Cu–Sn–Ni intermetallic compounds (IMCs) interlayer in the micro-joints, formed from...

   Li** Mo, Chaowei Guo, ... Changqing Liu in Journal of Materials Science: Materials in Electronics

   Article 22 May 2018
   

10. A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices

    A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging....

    Hongliang Feng, Jihua Huang, ... Shuhai Chen in Journal of Electronic Materials

    Article 17 February 2017

11. Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C

    Interfacial reaction and shear behavior of the joints between Au-29Sn (at.%) solder and Ni- x Cu ( x = 20 at.%, 40 at.%, 60 at.%, and 80 at.%) substrate...

    J. Peng, R. C. Wang, ... H. S. Liu in Journal of Electronic Materials

    Article 07 December 2016

12. Sn/MWCNT Nanocomposites Fabricated by Ultrasonic Dispersion of Ni-Coated MWCNTs in Molten Tin

    Carbon nanotubes (CNTs) are regarded as a desirable filler to develop advanced composites including advanced solders due to their exceptional...

    Md Muktadir Billah, Quanfang Chen in Journal of Electronic Materials

    Article 16 January 2018

13. Electrochemical Deposition of Corrosion-Resistant Coatings from Tin–Nickel Alloys

    We propose the optimal composition of a polyligand ammonium-chloride-fluoride electrolyte and a mode of electrolysis for the deposition of functional...

    V. S. Kublanovsky, V. M. Nikitenko, N. I. Globa in Materials Science

    Article 01 March 2017
    

14. Effect of bismuth–tin alloy particle diameter on bonding strength of copper nanoparticles/bismuth–tin solder hybrid joints

    The effect of the diameter of Bi–Sn alloy particles on the bonding strength of hybrid joints formed between SiC chips and direct-bonded copper (DBC)...

    Toshikazu Satoh, Toshitaka Ishizaki, Masanori Usui in Journal of Materials Science: Materials in Electronics

    Article 02 February 2018
    

15. First-Principles Study of Substitution of Cu and Au for Ni in Ni₃Sn₂

    The effects of substitution of Cu and Au for Ni on the mechanical, thermodynamic and electronic properties of two different Ni ₃ Sn ₂ structures are...

    Yali Tian, ** Wu, Zhengxiong Lu in Journal of Electronic Materials

    Article 27 September 2016

16. Further insight into interfacial interactions in nickel/liquid Sn–Ag solder system at 230–350 °C

    Interfacial reactions are investigated between electrochemical deposited Sn-2 wt%Ag alloy and Ni for isothermal heating at various temperature...

    Divya Taneja, Marion Volpert, Fiqiri Hodaj in Journal of Materials Science: Materials in Electronics

    Article 24 August 2017
    

17. Progress in Ni-based anode materials for direct hydrocarbon solid oxide fuel cells

    Ni-based anode materials of solid oxide fuel cells (SOFCs) are susceptible to carbon deposition and deactivation in direct hydrocarbon fuels, greatly...

    Kangwei Wei, **nxin Wang, ... Yihan Ling in Journal of Materials Science

    Article 12 March 2018
    

18. First-Principles Study of Substitution of Au for Ni in Ni₃Sn₄

    First-principles calculations were performed to investigate the effects of substitution of Au for Ni on the structural, elastic, thermodynamic and...

    Yali Tian, ** Wu in Journal of Electronic Materials

    Article 02 February 2018

19. Ag/Ni Metallization Bilayer: A Functional Layer for Highly Efficient Polycrystalline SnSe Thermoelectric Modules

    The structural and electrical characteristics of Ag/Ni bilayer metallization on polycrystalline thermoelectric SnSe were investigated. Two...

    Sang Hyun Park, Younghwan **, ... Chung-Yul Yoo in Journal of Electronic Materials

    Article 06 October 2016

20. Phase Equilibria of the Fe-Ni-Sn Ternary System at 270°C

    The Fe-42 wt.% Ni alloy, also known as a 42 invar alloy (Alloy 42), is used as a lead-frame material because its thermal expansion coefficient is...

    Tzu-Ting Huang, Shih-Wei Lin, ... Yee-Wen Yen in Journal of Electronic Materials

    Article 14 July 2016