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Showing 481-498 of 498 results
  1. Fault-Tolerant Multistage Interconnection Networks for Multiprocessor Systems

    In this paper we present a class of multipath multistage interconnection networks (MINs) called Augmented Shuffle-Exchange Networks. These MINs can...
    V. P. Kumar, S. M. Reddy in Concurrent Computations
    Chapter 1988
  2. Fault-Tolerant LU-Decomposition in a Two-Dimensional Systolic Array

    In this paper, we present a new systolic algorithm to solve LU-decomposition effeciently in a 2-D systolic array. The LU-decomposition is the main...
    J. H. Kim, S. M. Reddy in Concurrent Computations
    Chapter 1988
  3. Self-Diagnosable and Self-Reconfigurable VLSI Array Structures

    The issue of self-testing and self-reconfiguration of two-dimensional VLSI array structures are discussed in this paper. Analysis and synthesis are...
    Andrzej Rucinski, John L. Pokoski in Concurrent Computations
    Chapter 1988
  4. Network Traffic Scheduling Algorithm for Application-Specific Architectures

    For many application-specific and mission-oriented multiple processor systems, the interprocessor communication is deterministic and can be specified...
    Ronald P. Bianchini, John Paul Shen in Concurrent Computations
    Chapter 1988
  5. The Superfluid Helium On-Orbit Transfer (Shoot) Flight Experiment

    The SHOOT flight demonstration is being undertaken to verify component and system level technology necessary to resupply large superfluid helium...
    Michael J. Dipirro, Peter Kittel in Advances in Cryogenic Engineering
    Chapter 1988
  6. Injection Moulding of PVC

    Injection moulding is a commonly operated melt process, more extensively applied to thermoplastics other than PVC than to PVC itself, chiefly because...
    L. W. Turner in PVC Technology
    Chapter 1984
  7. Welded Joints

    The following types of manufacturing defects can be detected in welded butt joints by ultrasonics: slag inclusions, pores, lack of fusion (cold...
    Josef Krautkrämer, Herbert Krautkrämer in Ultrasonic Testing of Materials
    Chapter 1983
  8. Microcircuit Reliability Characterization

    With component densities doubling each year, semiconductor microcircuits present a particularly difficult challenge, in terms of characterizing their...
    Chapter 1980
  9. Fractography and Quality Assurance of Glass and Ceramics

    Fractography is the study of fragments. The sizes and shapes of fragments and the topography of the new surfaces generated by the fracture can be...
    Chapter 1979
  10. Process Control

    General principles of more traditional process control industries are increasingly being applied to the injection moulding manufacture process. In...
    Chapter 1978
  11. Failure Analysis of Armament Hardware

    In the broadest sense, armaments can be said to include the whole spectrum of equipments and associated hardware in the military inventory and, as...
    L. E. Samuels, I. R. Lamborn in Metallography in Failure Analysis
    Chapter 1978
  12. Training and Education

    It is very costly not to train and equally costly to do so for the wrong reasons. A company cannot completely sub-contract its training to outside...
    Chapter 1978
  13. A crystal-optical method for determining faults in glass

    M. V. Okhotin, A. V. Rybchinskaya in Glass and Ceramics
    Article 01 November 1962
  14. Management of applied rheological research

    Management of a section carrying out applied rheological research is discussed. The paper is concerned with the organisation of research, the...

    J. J. Benbow in Rheologica Acta
    Article 01 July 1969
  15. Review: Fatigue-crack propagation in metallic and polymeric materials

    Fatigue-crack propagation in metals and polymers is examined from the point of view of both the materials scientist and the engineer. Progress over...

    W. J. Plumbridge in Journal of Materials Science
    Article 01 August 1972
  16. “Glass Faults”

    M. A. Matveev, G. M. Matveev in Glass and Ceramics
    Article 01 September 1963
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