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Showing 21-40 of 201 results

  1. Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density

    In this study, the shear performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder...

    Yubing Gong, Longgen Liu, ... Hongbo Qin in Journal of Materials Science: Materials in Electronics
    Article 06 October 2022

  2. Influence of 0.05 wt% Pr addition on interfacial microstructure and mechanical properties of Sn–0.3Ag–0.7Cu/Cu solder joint during thermal shocking

    In this study, the influence of 0.05 wt% rare earth (RE) Pr element addition on the thermal shocking reliability of low-silver Sn–0.3Ag–0.7Cu...

    Peng Zhang, Songbai Xue, ... Jie Wu in Journal of Materials Science: Materials in Electronics
    Article 14 February 2022

  3. Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

    In this paper, different mass fractions (0, 0.01, 0.03, 0.05, 0.07, and 0.09 wt.%) of graphene nanosheets (GNSs) were selected as a strengthening...

    Mu-lan Li, Li-li Gao, ... Lei Zhang in Journal of Materials Science: Materials in Electronics
    Article 08 October 2021

  4. Monte Carlo-Based Stochastic Finite Element Model for Electromigration in the Interfaces of SAC Solder and Cu Conductors with Uncertainties in Boundary Conditions

    The time-dependent progress of electromigration (EM) in the interfaces of Sn-Ag-Cu solder and Cu conductors is sensitive to the uncertainties in...

    Liu Chu, Jiajia Shi, Eduardo Souza de Cursi in Journal of Electronic Materials
    Article 22 March 2022

  5. Substrate Stimulated Orientation for Pure Aluminum

    Oriented materials are of great importance, but their formation is rarely described. Here, nine Al/Al 2 O 3 systems were designed to identify the...

    W. Guo, S. Cao, ... J. Li in Metallurgical and Materials Transactions A
    Article 20 October 2021

  6. Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

    Co-based alloys have received extensive attention as barrier layers of Sn/Cu joints in the microelectronic packaging. However, little attention has...

    Shuhui Chen, Chenlin Yang, ... Tao Hang in Journal of Materials Science
    Article 03 January 2022

  7. Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing

    Sn58Bi is a promising lead-free solder alloy for low-temperature soldering of electronic packaging. Because of the uneven distribution of the tin...

    Hongbo Qin, Chuyi Lei, ... Wangyun Li in Journal of Electronic Materials
    Article 02 January 2022

  8. Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding

    By reflowing Cu/Sn/Ni ultrafine interconnects under a temperature gradient, a new transient liquid phase (TLP) bonding process was proposed for...

    Yi Zhong, Ning Zhao, ... Ching** Wong in Journal of Materials Research
    Article 01 August 2017

  9. Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient

    A novel solid–liquid interdiffusion (SLID) bonding method with the assistance of temperature gradient (TG) was carried out to bonding Cu and Ni...

    Yanqing Lai, Shi Chen, ... Ning Zhao in Acta Metallurgica Sinica (English Letters)
    Article 01 June 2022

  10. Electromigration Behavior of Cu Core Solder Joints Under High Current Density

    Abstract

    Cu core solder ball (CCSB) is formed by a Cu core surrounded by solder alloy and is used as an interconnection material for 3D packaging....

    Haksan Jeong, Choong-Jae Lee, ... Seung-Boo Jung in Electronic Materials Letters
    Article 12 August 2020

  11. One-bath one-step dyeing of polyester/cotton (PC) blends fabric with disperse dyes after acetylation of cotton

    Aiming at the classic problem of dyeing of polyester–cotton blended fabric one-bath one-step dyeing of PC blends with disperse dye after surface...

    Girmaye Kumsa, Gemeda Gebino, Gezu Ketema in Discover Materials
    Article Open access 28 September 2021

  12. Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration

    Interfacial reactions in Ni/Sn/Ni and Ni/Sn-9Zn/Ni micro solder joints during thermomigration (TM) have been studied by reflowing solder joints on a...

    N. Zhao, J. F. Deng, ... H. T. Ma in Journal of Electronic Materials
    Article 29 November 2016

  13. RETRACTED ARTICLE: Nanofluids: properties and applications

    Abstract

    Nanofluids are liquid suspensions of hard nanometer-sized particles suspended in a base fluid. The suspension of small...

    Ghassan Fadhil Smaisim, Doaa Basim mohammed, ... Ehsan Kianfar in Journal of Sol-Gel Science and Technology
    Article 02 July 2022

  14. Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing

    Abstract

    The interfacial behaviors of Cu/molten Sn–58Bi/Cu solder joints under the coupling effect of a temperature gradient and the current stressing...

    Fengjiang Wang, Hong Chen, ... **ao**g Wang in Electronic Materials Letters
    Article 12 November 2018

  15. In memoriam: Thomas R. Anthony

    R. Alben, G. S. Cargill III, F. Spaepen in MRS Bulletin
    Article 10 October 2018

  17. Thermo-electro-mechanical modeling, simulation and experiments of field-assisted sintering

    Contact growth and temperature behavior in time during a single high-current pulse representing the initial stage of field-assisted/spark plasma...

    A. S. Semenov, J. Trapp, ... B. Kieback in Journal of Materials Science
    Article 07 May 2019

  18. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

    Electronic devices need to work at high temperature in some fields for a long time, peculiarly step soldering technology, primary packaging and...

    ** Wang, Liang Zhang, Mu-lan Li in Journal of Materials Science: Materials in Electronics
    Article 01 December 2021

  19. Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint

    Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced...

    Md. Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling in Journal of Electronic Materials
    Article 15 October 2020

  20. Formation of Intermetallic Compounds and Microstructure Evolution due to Isothermal Reactive Diffusion at the Interface Between Solid Co and Liquid Sn

    Co has been studied extensively by many research groups as an alternative material for underbump metallization, since Co–Sn compounds show better...

    Noritomo Odashima, Minho O, Masanori Kajihara in Journal of Electronic Materials
    Article 04 December 2019
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