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Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging
This study focuses on the process optimization of pressureless Cu sintering for semiconductor die attach application. The die attachment joints were...
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Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders
This study investigated the interfacial reactions of Co with molten In and eutectic In–48at.%Sn solders at different temperatures. For the In/Co...
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Low Temperature Soldering 6061 Aluminum Alloys by Using the Synthesized Sn9Zn Nano-Amorphous Particles
AbstractTo meet the growing demand of technologies of high performance electronics, nano-solders have been widely developed. In the present study,...
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Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature
In situ tensile tests on Sn-3.5Ag lead-free solder were performed with different rates of 10 μ m/s and 300 μ m/s at − 198 °C liquid nitrogen...
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Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders
In this paper, the oxidation resistance of SCN (Sn–0.7Cu–0.05Ni), SCP (Sn–0.7Cu doped by 0.02 wt% P), and SCNPG solder alloys (Sn–0.7Cu with 0.007...
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Effect of Al Addition on Electrochemical Behavior of Sn-0.7Cu-xAl Lead-Free Solders Alloys in 3.5 wt.% NaCl Solution
The corrosion behavior of alloys is highly significant as far as lead-free solder applications are concerned. The corrosion performance of the alloy...
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Electrochemical behaviour of lead-free Sn–0.7Cu–xIn solders alloys in 3.5 wt% NaCl solution
Various electronic equipment has been exposed to a very harsh atmospheric condition that results in corrosion of the solders inside it. The type of...
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The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders
Pb-free solders are gaining ground as the optimum choice for electrical interconnect materials, however, their higher melting temperature around 217...
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The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys
With low liquidus temperatures, low raw material costs, and non-toxicity, Sn-Bi low-temperature solders are promising candidates for the replacement...
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Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics
Low-temperature soldering technology (185–195 °C) is applied for assembling consumer electronics with various Bi contents, and board-level drop...
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Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules
A copper foam–silver composite for large-area interconnections of power modules is proposed, which is prepared by homogeneously mixing a solid copper...
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Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
Lead-free solder, tin, tin/silver (SnAg), and tin/silver/copper (SnAgCu) alloy nanoparticles with various sizes were synthesized via a...
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Surface Precipitation and Growth of Bismuth Particles in Sn-Ag-Cu-Bi Solder Joints
With the advance in heterogeneous integration packaging, there has been a demand for solders with ideal mechanical properties and ideal melting...
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Investigation of Thermal Properties and Thermal Reliability of Ga-based Low Melting Temperature Alloys as Thermal Interface Materials (TIMs)
GalliumGa alloys-based low melting temperature alloysLow melting temperature alloys (LTAs) have been proposed as candidates for next generation...
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Microalloying effects of Sb and Ag on the microstructural evolution of eutectic Sn–Bi alloys
The low melting temperature of eutectic Sn–Bi alloys (139 °C) makes eutectic Sn–Bi a suitable low temperature alternative to high-Sn, lead-free...
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Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions
With the trend of technology development and carbon reduction, reducing the process temperature to prevent greenhouse effects is of great urgency....
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Effect of Sb and Ag additions on the melting and solidification of Sn-Bi solder alloys
Low temperature solders based on tin-bismuth (Sn-Bi) are used as substitutes for tin-silver-copper (Sn-Ag-Cu, SAC) alloys, reducing warpage-induced...
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Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties
A novel friction micro-welding (FMW) technology was used for copper column connection of column grid array (CGA) packaging. The investigation found...
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Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder
With the increasing miniaturization and power of optoelectronic devices, direct bonding of optical substrates like semiconductors and ceramics to...
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Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling performance in harsher conditions. Here, we investigate...