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1. Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications

   The suitability of Ni–Sn combination paste as a transient liquid phase sintering (TLPS) bonding material for applications in high-temperature power...

   So-Eun Jeong, Seung-Boo Jung, Jeong-Won Yoon in Journal of Materials Science: Materials in Electronics

   Article 28 July 2020
   

2. Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process

   Thermal behavior and phase ratios optimization are the theoretical foundations to tailor the solder joints with high performance and high...

   Hao Pan, Dashi Lu, ... Hongjun Ji in Journal of Materials Science: Materials in Electronics

   Article 20 January 2023
   

3. Multifunctional cellular carbon foams derived from chitosan toward self-cleaning, thermal insulation, and highly efficient microwave absorption properties

   To adapt the practical demand, designing and constructing the multifunctional microwave absorbers (MAs) is the key future direction of research and...

   Beibei Zhan, Yanling Hao, ... Wei Zhong in Nano Research

   Article 30 November 2023
   

4. Polymorphic cerium-based Prussian blue derivatives with in situ growing CNT/Co heterojunctions for enhanced microwave absorption via polarization and magnetization

   In this paper, the structure evolution of cerium cobaltohexanoate (Ce[Co(CN) ₆ ], Ce-Co Prussian blue analog (PBA)) has been realized by solvent...

   Jixi Zhou, **nmeng Huang, ... Zirui Jia in Nano Research

   Article 18 November 2023
   

5. Low-dimensional cobalt doped carbon composite towards wideband electromagnetic dissipation

   Composites composed of a carbon matrix decorated with a metal or metal oxide derived from zeolitic imidazolate frameworks (ZIFs) have been widely...

   **aodi Zhou, Biao Zhao, Hualiang Lv in Nano Research

   Article 22 September 2022
   

6. Development of sandwich joining piece to fabricate segmented half-Heusler/skutterudite thermoelectric joints

   Abstract

   Sn/Ni–Sn/Sn sandwich joining piece was developed and applied to fabricate segmented half-Heusler/skutterudite thermoelectric joints, and...

   Wei-An Wang, **ao-Ya Li, ... **-Hui Fan in Rare Metals

   Article 24 June 2020
   

7. Self-assembly tungsten selenide hybrid ternary MOF derived magnetic alloys via multi-polarization to boost microwave absorption

   Confronted with severe electromagnetic wave pollution, the development of high-performance electromagnetic wave shielding or absorbing materials is...

   Tianbao Zhao, Tingting Zheng, ... Guanglei Wu in Nano Research

   Article 04 November 2023
   

8. Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition

   Nanocrystalline Ni-Mo coatings, obtained by electroplating, were investigated as an alternative barrier layer between the Cu substrate and Sn solder....

   Agnieszka Bigos, Fabrizio Valenza, ... Joanna Wojewoda-Budka in Journal of Materials Engineering and Performance

   Article 11 April 2022
   

9. Microstructural evolution and shear performance of AuSn20 solder joint under gamma-ray irradiation and thermal cycling

   Owing to the excellent stability and mechanical strength, AuSn20 solder is of particular importance to the die attachment in aerospace power modules....

   Li Wen, Songbai Xue, ... Jie Wu in Journal of Materials Science: Materials in Electronics

   Article 28 March 2020
   

10. Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging

    This paper conducted high-temperature aging to investigate the thermal reliability of Cu-Sn full intermetallic compound joints. Microstructural...

    **anwen Peng, Yue Wang, ... **ngke Zhao in Journal of Materials Science: Materials in Electronics

    Article 19 October 2022
    

11. Stable and Metastable Phase Equilibria Involving the Cu₆Sn₅ Intermetallic

    Abstract

    Cu ₆ Sn ₅ intermetallic occurs in the form of differently ordered phases η, η′ and η′′. In solder joints, this intermetallic can undergo...

    A. Leineweber, M. Löffler, S. Martin in Journal of Electronic Materials

    Article Open access 26 July 2021
    

12. Study on the Kinetics of Ni₃Sn₄ Growth and Isothermal Solidification in Ni-Sn TLPS Bonding Process

    Abstract

    In this work, the kinetics of Ni ₃ Sn ₄ growth and the isothermal solidification kinetics in Ni-Sn transient liquid phase sintering bonding...

    Yue Wang, Zheng Ye, ... **ngke Zhao in Metallurgical and Materials Transactions A

    Article 27 February 2022
    

13. Hierarchical pomegranate-like MnO@N-doped carbon with enhanced conduction loss and interfacial polarization for tunable and broadband microwave absorption

    In order to tackle the electromagnetic pollution caused by the application of electromagnetic wave (EMW) in wireless communication, military...

    Chenxu Wang, Jiawei Ding, ... Fang He in Journal of Materials Science

    Article 14 December 2022
    

14. Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix

    Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In...

    M. Nasir Bashir, A. S. M. A. Haseeb, ... Manzoore Elahi M. Soudagar in Journal of Materials Science: Materials in Electronics

    Article 25 August 2022
    

15. Amorphous Sn modified nitrogen-doped porous carbon nanosheets with rapid capacitive mechanism for high-capacity and fast-charging lithium-ion batteries

    Sn-based materials are considered as a kind of potential anode materials for lithium-ion batteries (LIBs) owing to their high theoretical capacity....

    Chong Xu, Guang Ma, ... Yongfeng Li in Frontiers of Materials Science

    Article 23 June 2023

16. In-situ grown NiCo bimetal anchored on porous straw-derived biochar composites with boosted microwave absorption properties

    With the gradually increasing protection awareness about electromagnetic pollution, the demand for absorbing materials with renewability and...

    Yuanyuan Zhou, Zhongyi Bai, ... **aoqin Guo in International Journal of Minerals, Metallurgy and Materials

    Article 14 January 2023

17. Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints

    The effect of bimetallic monodisperse CoPd nanoparticles on the microstructure and the shear strength of the Cu/ SAC305/Cu solder joint was...

    Andriy Yakymovych, Adam Slabon, ... Otto Bajana in Applied Nanoscience

    Article 14 March 2020
    

18. Constructing BaTiO₃/TiO₂@polypyrrole composites with hollow multishelled structure for enhanced electromagnetic wave absorbing properties

    BaTiO ₃ /TiO ₂ @polypyrrole (PPy) composites with hollow multishelled structure (HoMS) were constructed to enhance the electromagnetic wave absorbing...

    Dan Mao, Zhen Zhang, ... Dan Wang in International Journal of Minerals, Metallurgy and Materials

    Article 14 January 2023

19. Wet-Chemical Synthesis of DO₁₉ Type Intermetallic Compounds: The Case for Ni₃Sn Nanoparticles

    The present study uses wet-chemical synthesis of highly crystalline single-phase Ni ₃ Sn nanoparticles in DO ₁₉ structure. Because of their high...

    Haseeb Ahmed, Hem C. Kandpal, Prayas Chandra Patel in Journal of Electronic Materials

    Article 19 September 2019

20. Physicochemical and Biocidal Properties of Nickel–Tin and Nickel–Tin—Titania Coatings

    Abstract—

    The morphology and composition of Ni–Sn and Ni–Sn–TiO ₂ coatings have been studied by scanning electron microscopy and energy-dispersive...

    A. V. Pyanko, I. V. Makarova, ... A. A. Chernik in Protection of Metals and Physical Chemistry of Surfaces

    Article 01 January 2021