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1. Effect of Trace Boron Nitride Nanoparticles on the Microstructure and Shear Properties of Sn58Bi Solder Joint

   In this paper, the influence of 0.01-0.05 wt.% hexagonal boron nitride (BN) nanoparticle do** on the microstructure and shear properties of Sn58Bi...

   Li Yang, Zheng Liu, ... Yaocheng Zhang in Journal of Materials Engineering and Performance

   Article 23 August 2023
   

2. Undissolved gold in fine-pitch BGA solder joint under thermal cycling test

   Crack propagation has been observed on the bulk solder area of the reworked fine-pitch ball grid array component with the solder joint type SAC305...

   Adlil Aizat Ismail, Maria Abu Bakar, ... Erwan Basiron in Journal of Materials Science: Materials in Electronics

   Article 27 April 2024
   

3. Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification

   We have elucidated the roles of Bi addition in the melting characteristics, wettability, microstructure evolution, and mechanical properties of...

   Wenbin Tu, Hanbing Wang, ... Jilin **e in Journal of Electronic Materials

   Article 10 April 2024
   

4. Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder

   In recent years, Sn-Bi solder has been widely used in the electronic packaging industry due to its low melting point. However, the segregation and...

   Dan Zhang, Haoran Ma, ... Yunpeng Wang in Journal of Electronic Materials

   Article 06 June 2024
   

5. Microstructure evolution and mechanical properties of ultrasonically soldered 7075 Al alloy joint with metal foam/Sn composite solder

   Low-temperature bonding of 7075 Al alloy with metal foam/Sn composite solder was achieved under ultrasound conditions. The effects of metal foam...

   Dan Li, Huaqiang Fu, ... Yong **ao in Welding in the World

   Article 05 July 2022
   

6. Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

   This study was aimed at examining the applicability of Cu–Sn system transient liquid phase (TLP) bonding using Cu foam to high-temperature operating...

   Min-Haeng Heo, Young-** Seo, Jeong-Won Yoon in Journal of Materials Science: Materials in Electronics

   Article 04 July 2024
   

7. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging

   Different amounts of Fe (0.005, 0.01, 0.03, 0.05, and 0.07 wt%) were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints...

   Quanzhen Li, Chengming Li, ... **aohong Yuan in Acta Metallurgica Sinica (English Letters)

   Article 15 April 2024
   

8. Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers

   A novel low-melting-point solder (LMS) and high-melting-point solder (HMS)-filled solderable isotropic polymer composite (LH-SIPC) was developed to...

   Min Jeong Ha, Jeong Il Lee, ... Byung-Seung Yim in Journal of Materials Science: Materials in Electronics

   Article 28 September 2023
   

9. Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste

   The main aim of this study is to determine the effect of dopant particles on the spreadability of composite solder paste during the reflow soldering...

   M. Tamizi, M. Movahedi, A. H. Kokabi in Journal of Materials Science: Materials in Electronics

   Article 11 February 2023
   

10. Development of carbonaceous tin-based solder composite achieving unprecedented joint performance

    Weight reduction and improved strength are two common engineering goals in the joining sector to benefit transport, aerospace, and nuclear industries...

    Sara Hawi, Somayeh Gharavian, ... Hamed Yazdani Nezhad in Emergent Materials

    Article Open access 30 December 2021
    

11. Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint

    Eutectic Sn–Bi alloy is acquiring significant observation in the electronic packaging industry because of its advantageous properties such as...

    Muhammad Nasir Bashir, A. S. M. A. Haseeb, ... Iqra Javed in Journal of Materials Science: Materials in Electronics

    Article 25 January 2023
    

12. Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

    Cu/In-48Sn- x CuZnAl/Cu ( x = 0, 0.1, 0.2, 0.4, 0.6 wt.%) solder joints were prepared by transient liquid phase (TLP) bonding. The microstructure and...

    Li Yang, Haodong Wu, ... Qiusheng Lin in Welding in the World

    Article 13 November 2023
    

13. Low-Cycle Fatigue Behavior of Sn-0.3Ag-0.7Cu-0.5CeO₂ Composite Solder Alloy

    The low-cycle fatigue behavior of Sn-0.3Ag-0.7Cu-0.5CeO ₂ composite solder alloy was studied. The results show that the fatigue life exponent and...

    L. Li, Z. H. Li, ... G. Y. Li in Journal of Electronic Materials

    Article 08 October 2022
    

14. Effect of pre-soldering temperatures on the microstructures and shear behaviors of SnBi-SAC/ENIG solder joints

    ​Thermal deformation during soldering between the chip and the substrate is an important factor affecting the quality of high-density packaging of...

    Shiqing Lv, Yang Liu, ... Chaoyang **ng in Journal of Materials Science: Materials in Electronics

    Article 08 May 2024
    

15. Strengthening mechanism of Ni-modified graphene nanosheets reinforced SnAgCuRE composite solder/Cu joints

    Based on the unique structure, excellent physical and mechanical properties of graphene nanosheets (GNSs), thermal decomposition method was used to...

    Huigai Wang, Keke Zhang, ... Bingying Wang in Journal of Materials Science: Materials in Electronics

    Article 26 October 2021
    

16. Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

    An influence of carbon nanotubes and carbon nanospheres coated by Au–Pd and Pt on the microstructure of solder/copper joints at room temperature and...

    Yuriy Plevachuk, Peter Švec Sr, ... Alexander Rud in Applied Nanoscience

    Article Open access 07 July 2023
    

17. Fabrication and properties of NiO-modified Al₂O₃ reinforced Sn1.0Ag0.5Cu composite solder and soldering performance

    NiO-modified Al ₂ O ₃ (NiO–Al ₂ O ₃ ) as the reinforcing phase of solder matrix was prepared by impregnation method, and then, the prepared reinforcing phase...

    Bingying Wang, Yong** Wu, ... Keke Zhang in Journal of Materials Science

    Article 23 September 2022
    

18. Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint

    To improve the mechanical properties of SnBi solder joints, Sn–Ag–Cu–Bi–Ni (SACBN) bumps were pre-soldered on the Cu pads, and thus the SnBi/SACBN/Cu...

    Yang Liu, Jian Chang, ... **anghua Zeng in Journal of Materials Science: Materials in Electronics

    Article 09 March 2022
    

19. Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process

    Thermal behavior and phase ratios optimization are the theoretical foundations to tailor the solder joints with high performance and high...

    Hao Pan, Dashi Lu, ... Hongjun Ji in Journal of Materials Science: Materials in Electronics

    Article 20 January 2023
    

20. Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints

    Herein, the microstructure evolution, crack initiation and propagation, and β-Sn recrystallization behavior of nano-intermetallic compound...

    He Gao, Wei Liu, ... Yanhong Tian in Journal of Materials Science: Materials in Electronics

    Article 03 October 2023