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Machine Allocation in Semiconductor Wafer Fabrication Systems: A Simulation-Based Approach
The problem of maximizing the throughput of Semiconductor Wafer Fabrication Systems is addressed. We model the fabrication systems as a Stochastic...
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Silicon Wafer Processing
This chapter reviews the Si wafer-processing technology, including ingot heat treatment, cutting, slicing, lap**, polishing, wafer cleaning, and...
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A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding
In wafer–wafer hybrid bonding, maintaining vigorous reliability of bonding and minimal deformation is essential. This paper probes the methodology...
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200-mm-wafer-scale integration of polycrystalline molybdenum disulfide transistors
Two-dimensional semiconductors are an attractive material for making thin-film transistors due to their scalability, transferability, atomic...
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A Hybrid Multi-objective Genetic Algorithm Combined with Dispatching Rule for Wafer Test Scheduling
Wafer test, also known as wafer probe or wafer sort, is a critical process that ensures the quality of dies after the wafer has been fabricated....
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A vacuum-deposited polymer dielectric for wafer-scale stretchable electronics
Despite recent advances in materials and fabrication technologies, the development of intrinsically stretchable electronic devices with large-area...
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Wafer particle inspection technique using computer vision based on a color space transform model
The preparation of defect-free wafers serves as a critical stage prior to fabrication of devices or chips as it is not possible to pattern any...
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Data-driven aggregate modeling of a semiconductor wafer fab to predict WIP levels and cycle time distributions
In complex manufacturing systems, such as a semiconductor wafer fabrication facility (wafer fab), it is important to accurately predict cycle times...
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Fabrication of MEMS Cantilever: A Case Study
MEMS technology can be incorporated into a wide variety of electronic components. Sensors are the dominant application of MEMS techniques; there are...
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Emerging MoS2 Wafer-Scale Technique for Integrated Circuits
As an outstanding representative of layered materials, molybdenum disulfide (MoS 2 ) has excellent physical properties, such as high carrier mobility,...
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Highly-sensitive wafer-scale transfer-free graphene MEMS condenser microphones
Since the performance of micro-electro-mechanical system (MEMS)-based microphones is approaching fundamental physical, design, and material limits,...
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Application of Deep Learning for Wafer Defect Classification in Semiconductor Manufacturing
Wafer map defect pattern classification is an important task for yield enhancement in semiconductor manufacturing. In this study, we proposed a...
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A new fabrication method for enhancing the yield of linear micromirror arrays assisted by temporary anchors
As one of the most common spatial light modulators, linear micromirror arrays (MMAs) based on microelectromechanical system (MEMS) processes are...
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Femtosecond laser-assisted fabrication of piezoelectrically actuated crystalline quartz-based MEMS resonators
A novel technology for the precise fabrication of quartz resonators for MEMS applications is introduced. This approach is based on the laser-induced...
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Wafer-level vapor cells filled with laser-actuated hermetic seals for integrated atomic devices
Atomic devices such as atomic clocks and optically-pumped magnetometers rely on the interrogation of atoms contained in a cell whose inner content...
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Production Scheduling of Semiconductor Wafer Fabrication Facilities Using Real-Time Combinatorial Dispatching Rule
Fabrication of semiconductor wafers is a complicated and challenging process with huge system complexity and stochasticity in operations. To improve...
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Machine Learning Support for Wafer-Level Failure Pattern Analytics
This chapter comprises four sections and is dedicated to wafer-level failure pattern analytics. Each section is based on a particular perspective...
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Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing
In this chapter, we outline the revolution of wafer bonding technologies in microelectromechanical systems (MEMS) packaging and their applications in...
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Development of Highly Sensitive and Stable SAW-based Temperature Sensor Array and its Interface Electronics for Realtime Monitoring of Wafer Surface Temperature in Plasma Chamber
Temperature sensor array and its associated peripheral interface electronics has been developed for real-time monitoring of the wafer surface...
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