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BGA Solder Ball Attaching Process Using Surface Tension of Liquid Solder
By accurately placing a fixed volume of solder bumps on the BGA pad for heating and melting, the molten solder transforms into solder balls of...
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Thermal Profile Prediction for Ball Grid Array Solder Joints Using Physic-Informed Artificial Neural Network
According to comparable research studies, the reflow process has been identified as the most critical process to the Printed Circuit Board (PCB)...
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Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration
We investigated the effect of fastening area of a board with mounted packages on the fatigue life of solder balls under random vibration. First, we...
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Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints
With the constant advancement of electronic science and technology, accurate failure analysis has become crucial to meeting stringent quality...
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Temperature- and Strain Rate-Dependent Damage Mechanics of Solder/IMC Interface Fracture in a Ball Grid Array Assembly
The damage mechanics concept introduced to assess the deformation and failure process of solder interconnects in electronic assemblies with ball grid...
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Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration
In this paper, the reliability of copper pillar micro-bump under random vibration is investigated. Three kinds of copper pillar solder joints with...
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Uniform Solder Droplet Deposition and Its 3D Printing Technology
By using tin–lead alloy, tin–silver alloy, and other tin solders, uniform tin solder droplet printing can direct manufacture uniform micro bump and...
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Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging
The effects of Mn addition (0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) on microstructure, shear mechanical behavior, and interfacial thermal stabilities...
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Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
The awareness of lead-free solders can be attributed to their environmental and human-health related benefits. Due to this consciousness, research...
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Prediction and Optimization of Residual Stress After Reflow Soldering of BGA Solder Joints Based on Multi-fidelity Surrogate Model
To solve the problem of difficult physical measurement and high simulation cost of residual stress after reflow soldering of BGA solder joints, a...
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Study on Laser Energy Absorption Efficiency of Solder Ball Based on Ray Tracing Method and Its Influencing Factors
As a new type of welding technology, compared with traditional reflow soldering and manual soldering, laser ball planting technology has the...
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Thermal Reliability Analysis and Structure Optimization of BGA Solder Joint Based on Genetic Algorithm
Due to the miniaturization of electronic packaging devices, the reliability of solder joints is required to be higher. The thermal fatigue failure of...
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Dynamic Adaptive Variable-Fidelity Modeling Method for BGA Solder Joint Design
Currently, building variable-fidelity surrogate models and using dynamic adaptive sampling is becoming a hot research topic in the field of...
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Optimized FE Model for System-Level Solder Joint Reliability Analysis of a Flip-Chip Ball Grid Array Package
When develo** solder constitutive models or investigating effects such as aging, stress triaxiality due to underfilling, thermal and power cycling...
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Finite Element Analysis on Soldered Joint Reliability of Ball Grid Array Device Under Thermal Shock
In this paper, finite element analysis with the constitutive relationships described by Anand model, is used to simulate thermally induced stresses...
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Numerical Simulation of Impact Response of Board-Level Packaging Structure
Board-level drop responses are critical to evaluate the mechanical reliability of solder joints to serve as electrical and mechanical connections in...
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A Sensitivity Study of BGA Geometrical Parameters Based on Electro-thermal Fatigue Analysis
The efficient operation of electronic products depends primarily on the reliability of the interconnections, provided by tiny solder joints,...
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Automatic Fault Detection in Soldering Process During Semiconductor Encapsulation
The high memory storage capacity is one of the main characteristics of current electronic devices. In the manufacture of high storage memories, more...
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A review on numerical approach of reflow soldering process for copper pillar technology
This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven by the semiconductor industry’s demands for thinner and...
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Thermal modeling and analysis of a power ball grid array in system-in-package technology
In power electronics, system-in-package (SiP) designs require an approach for the development of an accurate thermal analysis which is different from...
