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Showing 61-80 of 97 results

  2. A High-Throughput Cross-Linker Evaluation for Polyurethane Dispersions

    Materials science is on the verge of a fundamental change of its research and development (R&D) methodology. High-throughput experimentation,...
    Hermann Bach, Charles A. Gambino, ... Douglas A. Wicks in High-Throughput Analysis
    Chapter 2003

  3. Low-Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon — The European FLEX-SI Project

    Today there is a strong trend towards thin and flexible packages which is driven by different industrial applications e.g. smart cards and electronic...
    Thomas Harder, Wolfgang Reinert in Foldable Flex and Thinned Silicon Multichip Packaging Technology
    Chapter 2003

  4. ESD for Analogue Circuit Design

    Designing for Electrostatic Discharge (ESD) robustness is a critical requirement for Integrated Circuits (ICs) since ESD voltages as low as the Gate...
    Dave Clarke, Alan Righter in Analog Circuit Design
    Chapter 2003

  5. Atmosphere/Radiation/Aeronomy Missions

    An ESA Explorer mission, proposed in 1998, with the overall objective to obtain profiles of atmospheric parameters with occultation measurements...
    Herbert J. Kramer in Observation of the Earth and Its Environment
    Chapter 2002

  6. Test and Burn-in Sockets

    This chapter addresses the use of area-array socket technology during test and burn-in at the module level. Single chip and multichip modules (SCM,...
    Eugene Atwood, Glenn Daves in Area Array Interconnection Handbook
    Chapter 2001

  7. Manufacturing Considerations and Tools for Flip Chip Assembly

    The complexity of building an area-array manufacturing line is similar to constructing standard electronic-packaging facilities. Decisions which...
    David L. Edwards, Barrie C. Campbell, ... Camille Proietti-Bowne in Area Array Interconnection Handbook
    Chapter 2001

  16. Development of an application platform for mobile robots

    The experimental platform specified in this paper provides a promising basis for training and experimenting within the development of an intelligent...
    O. Buckmann, M. Krömker, U. Berger in Progress in system and robot analysis and control design
    Conference paper 1999

  17. Reliability of memories and microprocessors

    Silicon technology was (and still is) the dominant technology of the semiconductor industry; silicon devices have more than 95% market share of the...
    Titu I. Băjenescu, Marius I. Bâzu in Reliability of Electronic Components
    Chapter 1999

  18. An Application Platform for the Development and Experimental Validation of Mobile Robots for Health Care Purposes

    This paper describes an Application Platform for the development and testing of mobile robot units. Within this platform, various applications...

    Olaf Buckmann, Mathias Krömker, Ulrich Berger in Journal of Intelligent and Robotic Systems
    Article 01 July 1998

  19. Deposition

    Silicon integrated circuits continue to play an increasingly important role in the electronics industry. The content of integrated circuits in...
    Ted Kamins in Polycrystalline Silicon for Integrated Circuits and Displays
    Chapter 1998
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