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  1. No Access

    Article

    Molecular Dynamics Simulation of Copper Thin Film Growth on β-Ta (002) Substrate

    Tantalum can be used both as a diffusion barrier and an adhesion layer for copper metallization for semiconductor devices. Experiments show that β-Ta (200) substrates promote (111) texture growth in copper fil...

    Youhong Li, James B. Adams in MRS Online Proceedings Library (2011)

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    Article

    Microstructure Evolution Across Interfaces of Heterogeneous Metal Systems Under Ultrasonic Impact

    Large-scale Molecular Dynamics (MD) studies on heterogeneous, model metal systems subjected to intense shock loading by a flyer plate were carried out. Of interest here is the effect of structural defects on i...

    Youhong Li, Yinon Ashkenazy, Robert S. Averback in MRS Online Proceedings Library (2005)