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Article
Open AccessImpact Damage Characteristics of Carbon Fibre Metal Laminates: Experiments and Simulation
In this work, the impact response of carbon fibre metal laminates (FMLs) was experimentally and numerically studied with an improved design of the fibre composite lay-up for optimal mechanical properties and d...
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Article
Experimental Investigation of Effects of Polishing Process on Surface Residual Stress of TC4 Blade Based on Sensitivity Analysis
The residual compressive stress on polished surfaces can significantly delay the initiation of microscopic flaws, and improve the fatigue strength of engineered components. Reasonable selection of polishing pa...
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Article
Design and Analysis of a Dual-Permanent-Magnet-Excited Machine for Low-Speed Large-Torque Applications
This paper proposes a dual-permanent-magnet-excited machine (DPMEM). It employs three sets of permanent magnets (PMs). The first set of PMs is magnetized radially, and located among the rotor slots. The second...
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Article
Effects of B-Site Substitution on Up-Conversion Luminescence and Ferroelectric Properties in Er3+-Doped Strontium Barium Niobate
An effective route to regulate up-conversion luminescence (UCL) and polarization properties has been developed in tetragonal tungsten bronze ferroelectrics (TTBs). In this work, we have synthesized a series of...
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Chapter and Conference Paper
Multiple Cracks Interactions in Stress Corrosion Cracking: In Situ Observation by Digital Image Correlation and Phase Field Modeling
Interactions between multiple stress corrosion cracks (M-SCC) have a major influence on crack growth but are underestimated in models devoted to the evaluation of the lifetime of industrial components. In this...
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Article
Sintering Response and Equiaxed α-Ti Grain Formation in the Ti Alloys Sintered from Ti@Ni Core–Shell Powders
Using Ti@Ni core–shell powder is in favor of enhancing the sintering densification, obtaining the linear shrinkage response, forming equiaxed α-Ti grain, and reducing the oxygen contamination, compared to the ...
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Article
On the Study of the Sheet Bendability in AA5754-O Temper Alloy
The bendability of AA5754 aluminum alloy in fully recrystallized temper (O temper) has been studied. Both experimental and numerical work showed that a strong {001}〈100〉 Cube crystallographic texture in the sh...
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Article
Analysis of Surface Roughening in AA6111 Automotive Sheet Under Pure Bending
The finite element method is used to numerically simulate the topographic development in an aluminum sheet, AA6111, under pure bending. The measured electron backscatter diffraction data are directly incorpora...
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Chapter and Conference Paper
Numerical Simulation of Flat Rolling Practices
The hot rolling process with tapered ingot is simulated by finite element analysis. An in-house material model has been developed and implemented into ABAQUS finite element analysis software through a user mat...
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Chapter and Conference Paper
Numerical Analysis of Surface Roughening and Necking in Aluminum Alloy Tubes Under Internal Pressure
The crystal plasticity based finite element model is used to simulate surface roughening and localized necking in aluminum alloy tubes under internal pressure. A new approach for defining onset of necking is p...
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Article
Interface Cohesive Elements to Model Matrix Crack Evolution in Composite Laminates
In this paper, the transverse matrix (resin) cracking developed in multidirectional composite laminates loaded in tension was numerically investigated by a finite element (FE) model implemented in the commerci...
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Article
Fabrication and Characterization of Metal-Ferroelectric-Gan Structures
GaN-based metal-ferroelectric-semiconductor (MFS) structure has been fabricated by using ferroelectric Pb(Zr0.53Ti0.47)O3 (PZT) instead of conventional oxides as gate insulators. The GaN and PZT films in the MFS ...
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Article
Oxidation of Gallium Nitride Epilayers in Dry Oxygen
The oxidation of GaN epilayers in dry oxygen has been studied. The 1-μm-thick GaN epilayers grown on (0001) sapphire substrates by Rapid-Thermal-Processing/Low Pressure Metalorganic Chemical Vapor Deposition w...
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Article
Characteristics of GaN thin films by inductively coupled plasma etching with Cl2/BCl3 and Cl2/Ar
GaN thin films were etched by inductively coupled plasma (ICP). The effects of BCl3 and Ar with different Cl2 fraction are studied and compared. The ICP power and RF power are also altered to investigate the diff...
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Article
Initial stages of the cubic-InN growth with the technique of the pre-deposition of indium
The initial stages of the cubic indium nitride film growth at 350 °C were studied using low-pressure metal-organic chemical vapor deposition. The technique of the pre-deposition of indium was applied, that is,...
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Article
Mg-doped Nd-Ba-Cu-O generic seed crystals for the top-seeded melt growth of large-grain (rare earth)-Ba-Cu-O bulk superconductors
We report the fabrication of Mg-doped NdBCO generic seed crystals, which have been developed recently for the fabrication of any rare earth (RE) based (RE)-Ba-Cu-O single-grain superconductor, with a wide rang...
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Article
Synthesis and Properties of GaxMn1-xN films
Mn-doped GaN films were grown by hydride vapor phase epitaxy(HVPE). structural measurements show that Mn may substitute Ga atoms in the GaN lattice. Ferromagnetism is observed in these HVPE grown Mn-doped GaN ...
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Article
Dielectric properties of AlN film on Si substrate
AlN films were deposited on p-Si(1 1 1) substrates by a low-pressure metal–organic chemical vapor deposition (MOCVD) system and an Al–AlN–Si (MIS) capacitor was then prepared with the AlN layer as the insulato...
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Article
The effect of Ga on internal friction of pure Al before and after deformation
The grain boundary internal friction of pure Al and the same Al doped with different amounts of Ga (10, 50 and 410 ppm) was measured before and after high temperature deformation at two different modes (static...
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Article
Evaluation on the characteristics of tin-silver-bismuth solder
Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In t...