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    Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study

    This paper describes studies on the thermal annealing behavior of Cu films with 2.3 at.% W deposited on Si substrates. The magnetron cosputtered Cu films with insoluble W were vacuum annealed at temperatures r...

    C H Lin, J. P. Chu, T. Mahalingam, T. N. Lin, S. F. Wang in Journal of Materials Research (2003)