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  1. No Access

    Chapter

    Advances in Helium Cryogenics

    This review provides a survey of major advances that have occurred in recent years in the area of helium cryogenics. Helium-temperature cryogenics is the enabling technology for a substantial and growing numbe...

    S.W. Van Sciver in Cryogenic Engineering (2007)

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    Chapter

    Channel Heat Transfer in He I - Steady State Orientation Dependence

    Experimental investigations of liquid helium heat transfer from a channel configuration are reported. Four model test sections are constructed each consisting of a rectangular cross section channel 127 mm in l...

    Z. Chen, S. W. Van Sciver in Advances in Cryogenic Engineering (1986)

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    Chapter

    Boiling In Saturated He II

    In the present set of experiments, boiling regimes in saturated He II confined to a vertical rectangular (1 × 10 × 114 mm) channel are studied. These experiments are intended to model a cooling channel in a su...

    S. R. Breon, S. W. Van Sciver in Advances in Cryogenic Engineering (1986)

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    Chapter

    Stability Measurements of a Superconductor Cooled By a Two-Dimensional Channel of Helium II

    This report presents measurements on the stability of a He II cooled superconductor. The conductor is helically wound in a phenolic coil support and is cooled by a channel of He II which allows for heat transf...

    John M. Pfotenhauer, S. W. Van Sciver in Advances in Cryogenic Engineering (1986)

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    Chapter

    Steady State Forced Convection Heat Transfer in He II

    A study of forced convection heat transfer in superfluid helium (He II) is initiated to better understand the physical behavior of this process and to compare it with the more familiar He II heat transfer mech...

    A. Kashani, S. W. Van Sciver in Advances in Cryogenic Engineering (1986)

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    Chapter

    A Thin Film Amorphous Semiconductor Temperature Sensor

    Thin film temperature sensors for use in the liquid helium temperature range have been fabricated from an amorphous semiconductor-metal alloy of germanium and copper. The amorphous material (0.5 – 1.0 µm thick...

    D. Scott Holmes, S. W. Van Sciver in Advances in Cryogenic Engineering (1986)