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  1. No Access

    Article

    Effect of Thermoelectric Leg Thickness in a Planar Thin Film TEC Device on Different Substrates

    Recently, mobile application processors (APs) have suffered from thermal issues such as local hot spot generation. Several approaches for chip cooling, such as dynamic thermal management, and heat pipe cooling...

    Cheol Kim, Sangkug Park, Jeonglim Yoon, Hai-shan Shen… in Electronic Materials Letters (2019)

  2. No Access

    Article

    Stable Interconnect System for Horizontal Thermoelectric Coolers by Thermodynamic-Based Prediction

    We studied the improvement of interfacial stability and contact resistance by applying Cu with high electrical conductivity but high diffusivity to thin film type thermoelectric devices. Since the thin film de...

    Min-Woo Jeong, So-Yeon Lee, Hong-Bum Park, Hoo-Jeong Lee… in Electronic Materials Letters (2019)

  3. No Access

    Article

    Thermomechanical In Situ Monitoring of Bi2Te3 Thin Film and Its Relationship with Microstructure and Thermoelectric Performances

    Performance enhancement has been studied for thin-film thermoelectric materials for small-scale energy applications. The microstructural evolution of bismuth telluride (Bi2Te3) was investigated with respect to pe...

    Min-Woo Jeong, Sekwon Na, Haishan Shin, Hong-Bum Park… in Electronic Materials Letters (2018)