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Open AccessArtificial intelligence deep learning for 3D IC reliability prediction
Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is...
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Open AccessEnhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints
Cu–Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, cracks may form and propagate along the bonding interfaces during fatigue tests. In this study, Cu–Cu joints we...
