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Article
Aluminum Wiring Reliability of Fluorinated Amorphous Carbon Interlayer
We investigated the aluminum wiring reliability of fluorinated amorphous carbon (a-C:F) interlayer dielectrics (ILD) using electromigration tests at the wafer level under accelerated stress conditions with cur...
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Article
Dislocation structures adjacent to fatigue crack tips propagating at high rates in copper and 70/30 brass
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Article
Early stage crack tip dislocation morphology in fatigued copper
Observations of dislocation structures around the fatigue cracks in the early stage in polycrystalline copper were made through an ultrahigh voltage electron microscope operating at 2000 kV. Ladder like struct...