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    Article

    Aluminum Wiring Reliability of Fluorinated Amorphous Carbon Interlayer

    We investigated the aluminum wiring reliability of fluorinated amorphous carbon (a-C:F) interlayer dielectrics (ILD) using electromigration tests at the wafer level under accelerated stress conditions with cur...

    M. Iguchi, Y. Matsubara, S. Ito, K. Endo, K. Koyanagi in MRS Online Proceedings Library (1998)

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    Article

    Dislocation structures adjacent to fatigue crack tips propagating at high rates in copper and 70/30 brass

    K. Katagiri, J. Awatani, K. Koyanagi, Y. Onishi, M. Tsuji in Metallurgical Transactions A (1980)

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    Article

    Early stage crack tip dislocation morphology in fatigued copper

    Observations of dislocation structures around the fatigue cracks in the early stage in polycrystalline copper were made through an ultrahigh voltage electron microscope operating at 2000 kV. Ladder like struct...

    K. Katagiri, A. Omura, K. Koyanagi, J. Awatani in Metallurgical Transactions A (1977)