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    Study on Thermal Shock and Annealing Behavior of Sn3Ag0.5Cu-TSV Prepared by Modified Molten Metal Infiltration Method

    Filling and reliability of through-silicon via (TSV) are critical issues in the industrialization of TSV. In this study, Sn3.0Ag0.5Cu (SAC305) solder was used to fill TSV instead of the traditional Cu. The pur...

    Jiaojiao Wang, Limin Ma, Jianyu Feng, Yishu Wang, Fu Guo in Journal of Electronic Materials (2022)