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  1. No Access

    Article

    Effects of the Welding Process and Consumables on the Fracture Behavior of 9 Wt.% Nickel Steel

    In recent years, stringent environmental regulations for air pollution have led to increased demand for liquefied natural gas (LNG). Therefore, the demand for the design and construction of LNG-fueled vessels ...

    B.E. Kim, J.Y. Park, J.S. Lee, J.I. Lee, M.H. Kim in Experimental Techniques (2020)

  2. No Access

    Article

    Effect of microstructure modulation on mechanical properties of Ti-Fe-Sn ultrafine eutectic composites

    A series of (Ti70.5Fe29.5)100−xSnx alloys with x=0, 1, 3, 5, 7 and 9 were fabricated by a suction casting into cylindrical rods with a 3 mm diameter and 50 mm length. Microstructural investigations of these alloy...

    J. H. Han, G. A. Song, E. M. Park, S. H. Lee… in Metals and Materials International (2011)

  3. No Access

    Article

    Estimation of surface area concentration of workplace incidental nanoparticles based on number and mass concentrations

    Surface area was estimated by three different methods using number and/or mass concentrations obtained from either two or three instruments that are commonly used in the field. The estimated surface area conce...

    J. Y. Park, G. Ramachandran, P. C. Raynor, S. W. Kim in Journal of Nanoparticle Research (2011)

  4. No Access

    Article

    Friction and Adhesion Properties of Clean and Oxidized Al-Ni-Co Decagonal Quasicrystals: A UHV Atomic Force Microscopy/Scanning Tunneling Microscopy Study

    The tribological properties of adhesion and friction between 10-fold Al-Ni-Co decagonal quasicrystals and conductive W2C and TiN coated tips were studied in ultrahigh vacuum (UHV) with an atomic force microscope....

    J.Y. Park, D.F. Ogletree, M. Salmeron, C.J. Jenks, P.A. Thiel in Tribology Letters (2004)

  5. No Access

    Article

    Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization

    This paper reports the formation of intermetallic compounds in Au/Ni/Cu/Ti under-bump-metallization (UBM) structure reacted with Ag-Sn eutectic solder. In this study, UBM is prepared by evaporating Au(500 Å)/N...

    J. Y. Park, C. W. Yang, J. S. Ha, C. -U. Kim, E. J. Kwon… in Journal of Electronic Materials (2001)

  6. No Access

    Article

    Characteristics and Sintering Behavior of Yttria Powders Synthesized by the Combustion Process

    W.-J. Kim, J. Y. Park, S. J. Oh, Y. S. Kim… in Journal of Materials Science Letters (1999)

  7. No Access

    Article

    Al2O3-dispersed Cu Prepared by the Combustion Synthesized Powder

    J. Y. Park, S. J. Oh, C. H. Jung, G. W. Hong… in Journal of Materials Science Letters (1999)

  8. No Access

    Article

    Al-21Ti-23Cr High-Temperature Protective Coating on TiAl Intermetallic Compounds by RF Magnetron Sputtering

    Ti-48A1 specimens were coated with Al-21Ti-23Cr film at 200 W, 0.8 Pa and 573 K by RF magnetron sputtering. The oxidation behavior of the coated specimens was investigated through isothermal and cyclic oxidati...

    J. Y. Park, H. N. Lee, S. W. Park, M. H. Oh, D. M. Wee in MRS Online Proceedings Library (1996)

  9. No Access

    Article

    The direct bonding between copper and MgO-doped Si3N4

    An application of direct bonding method for copper to silicon nitride (Si3N4) joining was investigated. Si3N4 was sintered with 5wt% MgO at 1700 ° C for 30 min in nitrogen atmosphere, and oxidized at various temp...

    S. T. Kim, C. H. Kim, J. Y. Park, Y. B. Son, K. Y. Kim in Journal of Materials Science (1990)