5 Result(s)
within
Robotics and Automation
Dayuan **
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Chapter and Conference Paper
The Cleaning Process Scheme of Polluted Liquid Cooling Pipeline of a Electronic Equipment
Fluid connector seal failure occurs in a liquid cooling pipeline of an electronic equipment due to foreign matter pollution. Due to the existing cleaning equipment is simple and crude, this paper propose an ef...
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Chapter and Conference Paper
Application of Three-Dimensional Wiring Technology in Electronic Device
With the increasing performance and complexity of electronic device, internal wiring space is getting much smaller. It has been more difficult to meet product requirements using traditional manual wiring with ...
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Chapter and Conference Paper
CCGA Failure Analysis by Cutting Columns in Horizontal Cross-Section
A printed circuit board assembly (PCBA) was failed, and two pins routed from CCGA had no signal output in the electrical performance test at low temperature (−25 ℃). Visual inspection, X-ray and 3D X-ray exami...
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Chapter and Conference Paper
Systematic Verification of BGA Solder Joint Reliability in Multiple Ways
Based on the daily work summary and the induction of actual case processing methods, a systematic and hierarchical process verification scheme of BGA solder joints is proposed in the paper. Then the verificati...
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Chapter and Conference Paper
Research on Heat Dissipation Technology of the High-Power Array Antenna
In this paper, taking a 19-unit regular hexagonal array of a certain system as an example, a scaled array antenna model is designed based on the principle that the heat flux density and the mass flow per unit ...
