21 Result(s)
within
Dayuan **
Engineering
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Article
A size-independent systolic array for matrix triangularization and eigenvalue computation
A fixed-size systolic array which can efficiently triangularize arbitrarily large matrices is presented. The array performs orthogonal triangularization by applying Givens' rotations in parallel. For matrices ...
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Article
The oxidation of lead-free Sn alloys by electrochemical reduction analysis
The oxidation of pure tin and Sn-0.7Cu, Sn-3.5Ag, Sn-1Zn, and Sn-9Zn alloys at 150°C was investigated. Both the chemical nature and the amount of oxides were characterized using electrochemical reduction analy...
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Article
Blind Carrier Frequency Offset Estimation for OFDM System with Multiple Antennas using Multiple-invariance Properties
In this paper, we address the problem of carrier frequency offset (CFO) estimation for Orthogonal Frequency Division Multiplexing (OFDM) communications systems with multiple antennas. We reconstruct the receiv...
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Chapter and Conference Paper
An Artificial Endocrine-Emotion Model Based on Fuzzy Logic
Inspired by the biological information processing system, artificial endocrine system has drawn great research interest from many artificial intelligence experts during the past few years. Meanwhile, as an imp...
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Article
Relationship between Chief Executive Officer characteristics and corporate environmental information disclosure in Thailand
This study focuses on the influence of Chief Executive Officer (CEO) characteristics on environmental information disclosure (EID) in the annual reports of companies listed on the Stock Exchange of Thailand. A...
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Chapter and Conference Paper
The Cleaning Process Scheme of Polluted Liquid Cooling Pipeline of a Electronic Equipment
Fluid connector seal failure occurs in a liquid cooling pipeline of an electronic equipment due to foreign matter pollution. Due to the existing cleaning equipment is simple and crude, this paper propose an ef...
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Chapter and Conference Paper
Application of Three-Dimensional Wiring Technology in Electronic Device
With the increasing performance and complexity of electronic device, internal wiring space is getting much smaller. It has been more difficult to meet product requirements using traditional manual wiring with ...
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Chapter and Conference Paper
CCGA Failure Analysis by Cutting Columns in Horizontal Cross-Section
A printed circuit board assembly (PCBA) was failed, and two pins routed from CCGA had no signal output in the electrical performance test at low temperature (−25 ℃). Visual inspection, X-ray and 3D X-ray exami...
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Chapter and Conference Paper
Systematic Verification of BGA Solder Joint Reliability in Multiple Ways
Based on the daily work summary and the induction of actual case processing methods, a systematic and hierarchical process verification scheme of BGA solder joints is proposed in the paper. Then the verificati...
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Chapter and Conference Paper
Research on Heat Dissipation Technology of the High-Power Array Antenna
In this paper, taking a 19-unit regular hexagonal array of a certain system as an example, a scaled array antenna model is designed based on the principle that the heat flux density and the mass flow per unit ...
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Article
One-dimensional full-range mixture fraction measurements with femtosecond laser-induced plasma spectroscopy
Femtosecond laser-induced plasma spectroscopy (FLIPS) was performed to achieve full-range mixture fraction measurements in non-reacting CH4/air flow fields. A femtosecond laser at 800 nm was used to generate a pl...
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Article
Integrated optimization method for helical gear hobbing parameters considering machining efficiency, cost and precision
The formulation of dry hobbing processing parameters depends heavily on mass experiments and the experiences of skilled technicians, and the use of unsuitable parameters will lead to high cost, low efficiency ...
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Chapter and Conference Paper
Study on Assembly and Welding Process of High-Density Lead Devices in Aerospace Products
Today, more and more high-density lead devices are applied to aerospace board component products, as cores or important devices of printed board assembly products, the quality of the welding of high-density l...
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Chapter and Conference Paper
Research on Shipboard Button Design Based on Behavioral Psychology
This article outlines the guiding mechanism and role of behavioral psychology in product design, analyzes the behavior patterns and design requirements in some military button designs, and makes innovative des...
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Chapter and Conference Paper
Wiring Process for RF Cables with Equal Phase
With the increasing performance and complexity of electronic device, internal wiring space is getting much smaller. For equipment with phase consistency requirements, wiring is more difficult because RF cables...
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Chapter and Conference Paper
Research on SOP Analysis Product Design Method in Ergonomics
In this paper, purpose to redefine the semantics of product modeling, build an ergonomic modeling library based on ergonomics, form product identification genes, and guide product design. From the starting poi...
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Chapter and Conference Paper
BGA Solder Ball Attaching Process Using Surface Tension of Liquid Solder
By accurately placing a fixed volume of solder bumps on the BGA pad for heating and melting, the molten solder transforms into solder balls of uniform size under the action of surface tension. Simulation analy...
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Chapter and Conference Paper
Concurrent Multi-scale Design of Hybrid Composite Antenna
Most optimization methods of the fiber-reinforced composite materials mainly focus on the macro-scale design of the composite structure, such as ply design, which cannot exert the potential of the fiber-reinfo...
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Chapter and Conference Paper
Program Design of Forced Air Cooling System Based on Genetic Algorithm
The optimized design method of the traditional forced air cooling system is highly professional and low in efficiency. In this paper, firstly, the fan curve, physical parameters, friction factor, local flow re...
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Chapter and Conference Paper
Comparative Study on FEM Simulations and Experiments of Pyroshock Environment for Aerospace Electronic Products
Aerospace electronic products are subject to various impact loads from the outside world in the whole life during its production, transportation and working. Especially, the pyroshock environment has great inf...
