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Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules

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  1. Article

    Open Access

    Highly conductive and flexible fiber for textile electronics obtained by extremely low-temperature atomic layer deposition of Pt

    Thermal atomic layer deposition (ALD) of metal has generally been achieved at high temperatures of around 300 °C or at relatively low temperatures with highly reactive counter reactants, including plasma radic...

    Jaehong Lee, Jaehong Yoon, Hyun Gu Kim, Subin Kang, Woo-Suk Oh… in NPG Asia Materials (2016)

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  2. Article

    Open Access

    A facile method for the selective decoration of graphene defects based on a galvanic displacement reaction

    Inherent defects, such as grain boundaries (GBs), wrinkles and structural cracks, present on chemical vapor deposition (CVD)-grown graphene are inevitable because of the mechanism used for its synthesis. Becau...

    Juree Hong, Jae-Bok Lee, Sanggeun Lee, Jungmok Seo, Hyunsoo Lee… in NPG Asia Materials (2016)

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