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  1. No Access

    Article

    Lead-free ball-grid array balls: Production method and properties

    Production method and properties of lead-free ball-grid array (BGA) balls in comparison to standard BGA balls with the eutectic Sn-Pb composition are presented. Lead-free BGA balls can also be produced by an i...

    B. Kempf, M. Graff, O. Hutin, M. Rettenmayr in Journal of Electronic Materials (2002)

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    Article

    Zn-Al based alloys as Pb-free solders for die attach

    The present study examines the potential of Zn-Al based alloys for replacing Pb-containing solders used in the die-attaching process. Four alloys (Zn-6wt.%Al, Zn-6wt.%Al-1wt.%Ga, Zn-3wt.%Al-3wt.%Mg, and Zn-4wt...

    M. Rettenmayr, P. Lambracht, B. Kempf, C. Tschudin in Journal of Electronic Materials (2002)