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    Dielectric Barrier in the Subtractive Process of Formation of a Copper Metallization System

    This article studies various methods for the formation of dielectric diffusion barriers between open areas of copper and an organosilicate low-k dielectric in the subtractive method of forming a metallization sys...

    A. A. Orlov, A. A. Rezvanov, V. A. Gvozdev, G. A. Orlov… in Russian Microelectronics (2022)