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    Effect of curing procedure on the properties of copper-powder-filled conductive adhesives

    By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT...

    **aoling Zheng 郑小玲, Lulu Zhang, Min You 游 敏 in Journal of Wuhan University of Technology-… (2008)