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Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging
Pressure sensors play a vital role in aerospace, automotive, medical, and consumer electronics. Although microelectromechanical system (MEMS)-based...
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Simulation and Analysis of Molybdenum Tungsten Impact on Capacitive MEMS Pressure Sensor
This paper utilizes COMSOL software to conduct comprehensive simulations and analyses to evaluate the Micro-Electro-Mechanical System (MEMS)...
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On-orbit performance of high accuracy inertial grade MEMS accelerometer
Accelerometers play a pivotal role in spacecraft navigation, particularly in rendezvous and docking missions, by estimating incremental velocity with...
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Micro Electro-Mechanical Systems (MEMS)
Typical process technologies for MEMS device manufacturing include wet etching, dry etching, sacrificial layer technology, bonding, and SOI with...
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Packaging and Assembly Equipment
With the development of advanced packaging technology, More-than-Moore device has pushed the IC packaging to a more important status. Electronic...
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Products of Sensors and MEMS
MEMS stands for micro-electro-mechanical system, generally integrated with microsensors, microprocessors, and micromechanical structures. Based on...
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Mirrorless MEMS imaging: a nonlinear vibrational approach utilizing aerosol-jetted PZT-actuated fiber MEMS scanner for microscale illumination
This study introduces a novel image capture and lighting techniques using a cutting-edge hybrid MEMS scanner system designed for compact microscopic...
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Review: MEMS sensors for flow separation detection
Flow separation is a critical aerodynamic phenomenon impacting flight envelope of various flying objects. Its efficient detection and subsequent...
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Standardization of Integrated Circuits Packaging
Packaging standards define the requirements of structure, material, surface coating, external checking, and testing of product reliability, etc. This...
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MEMS and MOEMS Gyroscopes: A Review
Micro-gyroscopes using micro-electro-mechanical system (MEMS) and micro-opto-electro-mechanical system (MOEMS) are the new-generation and recently...
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MEMS reservoir computing system with stiffness modulation for multi-scene data processing at the edge
Reservoir computing (RC) is a bio-inspired neural network structure which can be implemented in hardware with ease. It has been applied across...
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Tuning antennas with EFFA RF-MEMS
A single production thin film work-flow is presented to monolithically integrate a new type of RF-MEMS variable capacitor, the electrostatic...
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Integrated silicon photonic MEMS
Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data...
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220 GHz Dual-Mode Dual-Band Waveguide Filter in Stackable Multilayer MEMS Technology
The development of next-generation transceiver system on the terahertz (THz) band demands the integration of key waveguide filters. In this paper, a...
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Reliability Analysis of Thermally Actuated MEMS Micromirror
This paper presents a reliability analysis of thermally actuated MEMS micromirror devices. The various factors affecting the reliability of the MEMS...
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An automatic Q-factor matching method for eliminating 77% of the ZRO of a MEMS vibratory gyroscope in rate mode
Mismatching quality factors (Q-factors) is one of the main factors causing zero-rate output (ZRO) in degenerate (DE) Micro-Electro-Mechanical Systems...
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Key Technologies and Processes for Traditional Packaging
Today, traditional packaging technologies still play important roles for most of the ICs, MEMS, and sensors due to the advantages of low cost, good...
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Bulk acoustic wave (BAW) resonator-based MEMS magnetic field sensor
This paper experimentally demonstrates a MEMS magnetic field sensor which is working at ∼ 0.873 GHz resonant frequency. The Bulk Acoustic Wave (BAW)...
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Thermally driven MEMS fiber-grippers
We investigate mechanical tangling for adhesion of microelectromechanical systems (MEMS) to unconventional carrier materials for assembly of highly...
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Development of Packaging and Testing Industry
IC packaging increasingly plays a more important role in the More-than-Moore era. Wire bonding, flip chip, and through-silicon-via (TSV) are...