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    Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing

    In this chapter, we outline the revolution of wafer bonding technologies in microelectromechanical systems (MEMS) packaging and their applications in the emerging field of micro/nanofluidics-enhanced sensing. ...

    Jikai Xu, Zhihao Ren, Bowei Dong, Chenxi Wang… in Advanced MEMS/NEMS Fabrication and Sensors (2022)