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Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu

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  1. Article

    Open Access

    Automated classification of granular bainite and polygonal ferrite by electron backscatter diffraction verified through local structural and mechanical analyses

    Differentiation of granular bainite and polygonal ferrite in high-strength low-alloy (HSLA) steels possesses a significant challenge, where both nanoindentation and chemical analyses do not achieve an adequate...

    R. M. Jentner, S. P. Tsai, A. Welle, S. Scholl in Journal of Materials Research (2023)

  2. Article

    Open Access

    Aluminum depletion induced by co-segregation of carbon and boron in a bcc-iron grain boundary

    The local variation of grain boundary atomic structure and chemistry caused by segregation of impurities influences the macroscopic properties of polycrystalline materials. Here, the effect of co-segregation o...

    A. Ahmadian, D. Scheiber, X. Zhou, B. Gault, C. H. Liebscher in Nature Communications (2021)

  3. Article

    Open Access

    In situ nanoindentation during electrochemical hydrogen charging: a comparison between front-side and a novel back-side charging approach

    The effects of hydrogen in metals are a pressing issue causing severe economic losses due to material deterioration by hydrogen embrittlement. A crucial understanding of the interactions of hydrogen with diffe...

    M. J. Duarte, X. Fang, J. Rao, W. Krieger, S. Brinckmann in Journal of Materials Science (2021)

  4. Article

    Open Access

    The peculiarity of the metal-ceramic interface

    Important properties of materials are strongly influenced or controlled by the presence of solid interfaces, i.e. from the atomic arrangement in a region which is a few atomic spacing wide. Using the quantitat...

    Zaoli Zhang, Yao Long, S. Cazottes, R. Daniel, C. Mitterer, G. Dehm in Scientific Reports (2015)

  5. Article

    Open Access

    Fracture and Delamination of Chromium Thin Films on Polymer Substrates

    New emerging technologies in the field of flexible electronic devices require that metal films adhere well and flex with polymer substrates. Common thin film materials used for these applications include coppe...

    M. J. Cordill, A. Taylor, J. Schalko, G. Dehm in Metallurgical and Materials Transactions A (2010)