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Article
Time-Domain Thermoreflectance Study of the Thermal Transport Properties of All-Solid-State Ionic Thermoelectric Material
The emerging ionic thermoelectric (i-TE) materials are promising for waste heat recovery and temperature sensors due to their huge ionic Seebeck coefficients. However, rare work concentrates on studying the intri...
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Article
A Detailed Thermal Resistance Network Analysis of FCBGA Package
Using thermal models to describe the heat dissipation process of FCBGA is a significant topic in the field of packaging. However, the thermal resistance model considering the structure of each part of the chip...
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Article
Open AccessBidirectionally promoting assembly order for ultrastiff and highly thermally conductive graphene fibres
Macroscopic fibres assembled from two-dimensional (2D) nanosheets are new and impressing type of fibre materials besides those from one-dimensional (1D) polymers, such as graphene fibres. However, the preparat...
