Abstract
A laser enables the confinement of optical energy to a limited small space, resulting in a highly controllable processing zone with high fabrication preciseness. Laser direct writing (LDW) is a fabrication method for structures in a laser-irradiated space or a scanned space and includes subtractive, additive, or modification processing. Laser ablation is a typical subtractive process method where material removal occurs at the laser-irradiated area, while laser sintering, photopolymerization, and photoreduction are widely known as additive methods. The femtosecond laser is a powerful tool for highly precise processing of various kinds of materials and realizes exclusive processing technologies. An understanding of the fundamentals is essential to maximize the outcome of femtosecond LDW. In this chapter, femtosecond LDW is described for both subtractive and additive material processing, starting with the fundamentals to understand the processing characteristics. Advantages and capabilities of femtosecond LDW are described with reference to recent studies.
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Terakawa, M. (2018). Femtosecond Laser Direct Writing. In: Yan, J. (eds) Micro and Nano Fabrication Technology. Micro/Nano Technologies. Springer, Singapore. https://doi.org/10.1007/978-981-13-0098-1_14
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DOI: https://doi.org/10.1007/978-981-13-0098-1_14
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