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In-Process Measurement of Subwavelength Structures

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Metrology

Part of the book series: Precision Manufacturing ((PRECISION))

Abstract

This chapter describes in-process measurement of subwavelength structures. Especially, from the viewpoint of affinity with in-process measurement, this chapter focuses on optical measurement, which provides in-process evaluation of engineering microstructure surfaces beyond the diffraction limit. First, application of optical super-resolution using structured light illumination to semiconductor patterns inspection is shown. Second, a new type of optical depth measurement of subwavelength microgrooves using an interference measuring method, which can measure the depth of microgrooves, with widths less than the diffraction limit, is described. Third, as an example of application of near-field optics for in-process measurement for quality of subwavelength structures, nano-thickness inspection of residual layer thickness during nanoimprint lithography is demonstrated. Through concrete examples, the possibility of an optical measurement method for the in-process measurement of subwavelength structures is discussed.

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Authors and Affiliations

  1. Research Center for Advanced Science and Technology (RCAST), The University of Tokyo, Tokyo, Japan

    Satoru Takahashi

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  1. Satoru Takahashi
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Correspondence to Satoru Takahashi .

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Editors and Affiliations

  1. Department of Nanomechanics, Tohoku University Department of Nanomechanics, Sendai, Miyagi, Japan

    Wei Gao

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Takahashi, S. (2019). In-Process Measurement of Subwavelength Structures. In: Gao, W. (eds) Metrology. Precision Manufacturing. Springer, Singapore. https://doi.org/10.1007/978-981-10-4912-5_15-1

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  • DOI: https://doi.org/10.1007/978-981-10-4912-5_15-1

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-4912-5

  • Online ISBN: 978-981-10-4912-5

  • eBook Packages: Springer Reference EngineeringReference Module Computer Science and Engineering

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