Synonyms
Definition
Packaging provides electrical or mechanical access to microdevices from the outside world. Packaging also provides protection to microdevices from being damaged by the elements, such as dust, moisture, and chemicals from the environment.
Wire bonding is a technology that connects microdevices to the outside world electrically using small metal wires.
Overview
Historically, packaging technology was developed by the integrated circuit (IC) industry. When semiconductor microdevices such as transistors are fabricated on a semiconductor wafer, electrical signals can only be accessed through many micrometer-sized metal lines and contacts using specialized equipment such as a probe station, equipped with an optical microscope and micromanipulators with fine tungsten needles. In order to provide low-cost, general access to the microdevices, semiconductor wafers are first diced into small chips (or dies), and small metal...
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References
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Chiao, M. (2014). Packaging (and Wire Bonding). In: Li, D. (eds) Encyclopedia of Microfluidics and Nanofluidics. Springer, Boston, MA. https://doi.org/10.1007/978-3-642-27758-0_1178-3
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DOI: https://doi.org/10.1007/978-3-642-27758-0_1178-3
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Publisher Name: Springer, Boston, MA
Online ISBN: 978-3-642-27758-0
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