Abstract
The shear strength and microstructural evolution of as-cast SAC305 solder joints by addition of various ceramic nanoparticles have been investigated. In contrast to the most popular approach of adding the nano-sized inclusions directly to the SAC solder, the nano-sized Al2O3, SiO2, TiO2, and ZrO2 were added to the commercial flux to improve the standard SAC305/Cu joints. In this case, the solder joint was prepared from a sandwich Cu/flux + nanoceramic/SAC305/flux + nanoceramic/Cu. The nanocomposite fluxes with various content (0–1.0 wt%) ceramic nanoparticles (NPs) were employed in our study. The analysis of the microstructure and mechanical properties of the produced hybrid SAC305 solder joints showed several satisfactory modified results. For instance, the growth kinetics of the interfacial Cu–Sn IMC decreased by the addition of Al2O3, SiO2, and ZrO2 NPs into the flux. The shear stress tests displayed an increase of this mechanical property of the corresponded hybrid solder joints. In contrast, an addition of up to 0.5 wt% nano-TiO2 increased the growth kinetics of the interfacial Cu–Sn layer. Furthermore, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 NPs into the SAC305 solder alloy.
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References
Ghosh SK, Haseeb ASMA, Afifi ABM (2013) Effects of metallic nanoparticle doped flux on interfacial intermetallic compounds between Sn–3.0Ag–0.5Cu and copper substrate. In: IEEE 15th electronics packaging technology conference (EPTC 2013), pp 21–26. https://doi.org/10.1109/EPTC.2013.6745676
MedCalc Software bv (2005–2019) https://www.digimizer.com/index.php
Roshanghias A, Kokabi AH, Miyashita Y, Mutoh Y, Hosseini HR (2013) Formation of intermetallic reaction layer and joining strength in nano-composite solder joint. J Mater Sci 24(3):839–847. https://doi.org/10.1007/s10854-012-0829-z
Roshanghias A, Khatibi G, Yakymovych A, Bernardi J, Ipser H (2016) Sn–Ag–Cu nanosolders: solder joints integrity and strength. J Electron Mater 45(8):4390–4399. https://doi.org/10.1007/s11664-016-4584-4
Sujan GK, Haseeb ASMA, Afifi ABM (2014) Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate. Mater Charact 97:199–209
Tan AT, Tan AW, Yusof F (2015) Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions. Sci Technol Adv Mat 16:033505. https://doi.org/10.1088/1468-6996/16/3/033505
TECNAN Navarrean Nanoproducts Technology (2012) Catalog, powder nanoparticles, Los Arcos, Navarra, Spain
Tsao LC (2011) An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate. Mater Sci Eng A 529:41–48. https://doi.org/10.1016/j.msea.2011.08.053
Wang Y, Zhao XC, **e XC, Gu Y, Liu Y (2015) Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder. J Mater Sci 26(12):9387–9395. https://doi.org/10.1007/s10854-015-3151-8
Yakymovych A, Plevachuk Yu, Svec P Sr, Svec P, Janickovic D, Sebo P, Beronska N, Roshanghias A, Ipser H (2016) Morphology and shear strength of lead-free solder joints with Sn3.0Ag0.5Cu solder paste reinforced with ceramic nanoparticles. J Electron Mater 45(12):6143–6149. https://doi.org/10.1007/s11664-016-4832-7
Yakymovych A, Svec P Sr, Orovcik L, Bajana O, Ipser H (2018a) Nanocomposite SAC solders: the effect of adding Ni and Ni–Sn nanoparticles on morphology and mechanical properties of Sn-3.0Ag-0.5Cu solders. J Electron Mater 47(1):117–123. https://doi.org/10.1007/s11664-017-5834-9
Yakymovych A, Weber H, Kaban I, Ipser H (2018b) Dynamic viscosity of a liquid Sn-3.0Ag-0.5Cu alloy with Ni nanoparticles. J Mol Liquid 268:176–180. https://doi.org/10.1016/j.molliq.2018.07.069
Yakymovych A, Kaptay G, Flandorfer H, Bernardi J, Schwarz S, Ipser H (2018c) The nano heat effect of replacing macro-particles by nano-particles in drop calorimetry: the case of core/shell metal/oxide nano-particles. RSC Adv 8:8856–8869. https://doi.org/10.1039/C7RA13643A
Zhang P, Xue S, Wang J, Xue P, Zhong S, Long W (2019) Effect of nanoparticles addition on the microstructure and properties of lead-free solders: a review. Appl Sci 9:2044. https://doi.org/10.3390/app9102044
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Aspalter, A., Cerny, A., Göschl, M. et al. Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux do**. Appl Nanosci 10, 4943–4949 (2020). https://doi.org/10.1007/s13204-020-01398-8
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DOI: https://doi.org/10.1007/s13204-020-01398-8