Abstract
SnPb solders have been widely used in many fields because of their excellent solderability. To respond to environmental and health concerns regarding SnPb solders, it is necessary to develop lead-free solder for electronic assembly. In this paper, the resistance to the electrochemical migration of eutectic SnPb and SnBi solder alloys was evaluated and analyzed to detect the difference in the electrochemical migration behavior between these solders by their electrochemical properties. Pb and Bi additions to a Sn-base solder improved the resistance to electrochemical migration because of enhanced polarization properties. The resistance was closely related to the cathodic deposition efficiency and the anodic dissolution behavior. In addition, the composition of the dendrite formed by the electrochemical migration was related to the standard electrode potential of the alloying element.
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J. P. Chung, Y. Y. Shin, and S. S. Lim, Pb-free Micro-Soldering, Samsung Books, Seoul, Korea (2001).
C. S. Kang and J. P. Chung, Micro Joining, Samsung Books, Seoul, Korea (2002).
J. Glazer, JEM 23. 8. 673 (1994).
S. Ganesan and M. Pecht, Lead-free Electronics, p. 50, CALCE, University of Maryland, College Park, Maryland (2004).
C. M. Chen and C. C. Huang, J. Alloy. Compd. 461, 235 (2008).
F. Hua, Z. Mei, and J. Glazer, Proceedings of the 48th Electronic Components and Technology Conference, p. 277 (1998).
E. C. C. Yeh, W. J. Choi, K. N. Tu, P. Elenius, and H. Balkan, Appl. Phys. Lett. 80, 580 (2002).
Y. C. Hu, Y. H. Lin, C. R. Kao, and K. N. Tu, J. Mater. Res. 18, 2544. (2003).
J. Y. Choi, S.S. Lee, Y.C. Joo, Jpn. J. Appl. Phys. 41, 7487 (2002).
G. A. Rinne, Microelectron. Reliab. 43, 1975 (2003).
C. M. Chen and S. W. Chen, J. Appl. Phys. 90, 1208 (2001).
J. H. Lee, G. T. Lim, S. T. Yang, M. S. Suh, Q. H. Chung, K. Y. Byun, Y. B. Park, J. Kor. Inst. Met. & Mater. 46, 310 (2008).
Q. L. Yang and J. K. Shang, J. Electron. Mater. 34, 1363 (2005).
IPC-TR-476A, Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies.
IPC-9201, Surface Insulation Resistance Handbook.
IPC-TM-650 2.6.14.1 Electrochemical Migration Resistance Test.
T. Takemoto, R. M. Latanision, T. W. Eagar, and A. Matsunawa, Corros. Sci. 38, 1415 (1997).
W. J. Ready and L. J. Turbini, J. Eletron. Mater. 31, 1208 (2002).
S. B. Lee, Y. R. Yoo, J. Y. Jung, Y. B. Park, Y. S. Kim, and Y. C. Joo, IEEE Electronic Components and Technology Conference, p. 621 (2006).
Y. R. Yoo and Y. S. Kim, Met. Mater. Int. 13, 129 (2007).
S. B. Lee, Y. R. Yoo, J. Y. Jung, Y. B. Park, Y. S. Kim, and Y. C. Joo, Thin Solid Films 504, 294 (2006).
G. Harsanyi and G. Inzelt, Microelectron. Reliab. 41, 229 (2001).
P. Zhao and M. Pecht, Microelectron. Reliab. 43, 775 (2003).
H. Tanaka, ESPEC Technology Report 14, 1 (2002).
A. J. Bard, R. Parsons, and J. Jordan, Standard Potentials in Aqueous Solution, IUPCA, New York and Basel. Marcel Dekker Inc. (1985).
Y. R. Yoo, H. S. Nam, J. Y. Jung, S. B. Lee, Y. B. Park, Y. C. Joo, and Y. S. Kim, Corros. Sci. & Tech. 6, 50 (2007).
Y. R. Yoo and Y. S. Kim, Met. Mater. Int. 16, 613 (2010).
J. H. Lee, G. T. Lim, S. T. Yang, M. S. Suh, Q. H. Chung, K. Y. Byun, and Y. B. Park, J. Kor. Inst. Met. & Mater. 46, 310 (2008).
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Yoo, Y.R., Kim, Y.S. Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders. Met. Mater. Int. 16, 739–745 (2010). https://doi.org/10.1007/s12540-010-1007-6
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DOI: https://doi.org/10.1007/s12540-010-1007-6