Abstract
The reliability of solders, especially under service conditions, is strongly influenced by their behavior under creep, thermomechanical fatigue, creep-fatigue interactions and the effects of aging on these properties. Stabilization of the solder microstructure during service will also significantly help in reliability prediction modeling. Among the various methods used to improve reliability and microstructure stabilization, one that holds significant promise, is the incorporation of compatible reinforcements by in-situ methods. The composite solder produced by utilizing this strategy exhibits improved properties that are likely to enhance service performance.
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Subramanian, K.N., Bieler, T.R. & Lucas, J.P. Microstructural engineering of solders. J. Electron. Mater. 28, 1176–1183 (1999). https://doi.org/10.1007/s11664-999-0154-3
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DOI: https://doi.org/10.1007/s11664-999-0154-3