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Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium

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Abstract

The interfacial reaction between Pb-Sn solders and bulk Pd substrate is studied both in the liquid- and solid-state of the solder. The interfacial microstructures are characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope. The correlation between the diffusion path and interfacial microstructure in 62Sn38Pb/Pd, 95Pb5Sn/Pd, and Pb/Pd diffusion couples is demonstrated by means of calculated isothermal sections of the Pb-Sn-Pd system and the metastable phase diagram of the Pb-Pd system.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Robert R. McCormick School of Engineering and Applied Science, Northwestern University, 2225 N. Campus Dr., 60208-3108, Evanston, IL

    G. Ghosh

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  1. G. Ghosh
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Ghosh, G. Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium. J. Electron. Mater. 27, 1154–1160 (1998). https://doi.org/10.1007/s11664-998-0064-9

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  • DOI: https://doi.org/10.1007/s11664-998-0064-9

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