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Quantitative Assessment of Dynamic Recovery Kinetics in Sn-5Sb Lead-Free Solder Alloy During Hot Working

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Abstract

The deformation behavior of Sn-5Sb alloys was investigated using isothermal hot compression at 300 K, 330 K, 360 K and 400 K and strain rates of 0.01 s−1, 0.005 s−1, 0.001 s−1 and 0.0005 s−1. The recorded true stress–strain curves were obtained from load–stroke data and their quantitative characteristics were analyzed. Relationships between the flow stress, temperature and strain rate were expressed in terms of the conventional hyperbolic sine equation. By performing regression, 54 kJ/mol was determined as the average activation energy of deformation. Based on σ (dσ/dε) versus σ curves, the coefficient of dynamic recovery (DRV) rate (r), saturated stress (σRV) and yield strength (σ0) under different thermomechanical conditions were computed. For the volume fractions of DRV, the modified Avrami type equation was derived as a function of the Zener–Hollomon parameter (Z) and the influence of deformation conditions on the kinetics of DRV was investigated in detail.

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Acknowledgements

The authors would like to thank Professor R. Mahmudi and Dr. A. R. Geranmayeh (Formability Laboratory in Collage of Engineering, University of Tehran) who provided insight and expertise that greatly assisted the research.

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Authors and Affiliations

  1. Materials Processing Simulation Laboratory (MPS – Lab), School of Metallurgy and Materials Engineering, Iran University of Science and Technology (IUST), Narmak, Tehran, Iran

    H. Vafaeenezhad, S. H. Seyedein, M. R. Aboutalebi & A. R. Eivani

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  1. H. Vafaeenezhad
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  2. S. H. Seyedein
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  3. M. R. Aboutalebi
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  4. A. R. Eivani
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Correspondence to H. Vafaeenezhad.

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Vafaeenezhad, H., Seyedein, S.H., Aboutalebi, M.R. et al. Quantitative Assessment of Dynamic Recovery Kinetics in Sn-5Sb Lead-Free Solder Alloy During Hot Working. J. Electron. Mater. 47, 6868–6877 (2018). https://doi.org/10.1007/s11664-018-6612-z

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  • DOI: https://doi.org/10.1007/s11664-018-6612-z

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